WMSIC Electronic Components

ADI/LINEAR MAX6816EUS+T MAX6816EUS

ModelMAX6816EUS+T
PackageSOT-143-4
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX6816EUS+T
Type
ADI/LINEAR
Minimum package
2500

Technical parameters

Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX6816EUS+T
Electronic Component
1
Package
SOT-143-4
Electronic Component
Analog Switch / Multiplexer
Electronic Component
0.037g
Electronic Component
1
Channel Count
1
Features
Electronic Component
Electronic Component
BM0258713075
Operating Temperature
40℃~+125℃
Operating Voltage
2.7V~5.5V
Switch
1:1
(tpd)
100ns
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX6816EUS+T 产品概述

一、产品简介

MAX6816EUS+T 为Analog Devices(原Maxim/Linear)系列的一款单通道开关去抖器,采用紧凑的SOT-143-4 封装。该器件用于连接机械按键或开关时对输入信号进行硬件去抖处理,输出稳定的逻辑电平,消除由于接点抖动导致的多次触发。器件工作电压范围为 2.7V 至 5.5V,工作温度范围为 -40℃ 至 +125℃,适合工业与消费类产品中的可靠开关检测需求。

二、主要特性

  • 单刀单掷(SPST)开关输入,单通道设计,便于单点按键或开关的去抖应用。
  • 宽工作电压:2.7V ~ 5.5V,直接兼容常见 MCU/逻辑电平(包括3.3V 与5V 系统)。
  • 宽工作温度:-40℃ ~ +125℃,满足严苛环境下的可靠性要求。
  • 封装:SOT-143-4(4 引脚小型封装),占板面积小,适合集成度高的电路板设计。
  • 提供稳定的逻辑输出,减少固件层面的去抖负担,提高系统响应可靠性。
  • 器件设计针对机械抖动优化,可显著降低因接触抖动产生的误触发与噪声。

三、功能与引脚说明

MAX6816EUS+T 为典型的开关去抖器,其基本功能是将机械开关产生的抖动滤除,输出一个稳定的数字边沿。常见的四引脚 SOT-143 配置(示意)通常包括:VCC、GND、输入(SW_IN)与输出(OUT)。具体功能描述如下:

  • VCC:电源引脚,连接 2.7V ~ 5.5V 直流电源。
  • GND:系统地。
  • IN(或 SW):与机械按键或开关闭合点相连,接收有抖动的原始信号。
  • OUT:去抖后产生的逻辑输出,可直接驱动 MCU 的 GPIO 或后端逻辑。

(注:实际引脚排列请以官方数据手册为准;不同封装或命名可能有细微差异。)

四、典型应用场景

  • 按键与用户界面:消除按键弹跳,提供稳定的按键事件给 MCU,简化软件去抖逻辑。
  • 开关检测:用于电源开关、模式选择开关等需要可靠状态检测的场合。
  • 工业控制面板:在噪声、振动环境下提高按键检测的稳定性与可靠性。
  • 汽车、仪表与便携设备:配合宽温和宽电压特性,可在恶劣环境下稳定工作。
  • 人机界面(HMI)与电器控制:减少因抖动导致的误动作与多次触发。

五、设计与布局建议

为保证 MAX6816EUS+T 在系统中的性能与可靠性,建议在 PCB 设计与原理图时注意以下要点:

  1. 电源去耦:在 VCC 与 GND 之间靠近器件放置 0.1µF 陶瓷去耦电容,抑制电源噪声,避免误触发。
  2. 接地处理:尽量将器件地与系统地良好连接,避免长地线或回路噪声影响去抖性能。
  3. 输入连接:机械开关一端接器件输入,另一端接地或 VCC(按使用方式);若为长线或外部开关,考虑在输入端增加 RC 滤波或串联阻抗以减少感应噪声。
  4. 上拉/下拉:根据系统需求,OUT 端通常可直接驱动 MCU。如果系统要求特定静态电平,可在器件输出或 MCU 侧增加合适的上拉/下拉电阻。
  5. ESD 抗扰:外部按键或开关暴露在外时,建议在输入端考虑额外的 TVS 或串联电阻以提高抗静电与浪涌能力。
  6. 布局与热管理:SOT-143-4 为小封装,焊盘与走线按生产商推荐的焊盘规则设计,保证焊接可靠性与长期稳定工作。

六、封装与订购信息

  • 封装型号:SOT-143-4(4 引脚)
  • 品牌:Analog Devices(ADI)/ LINEAR(Maxim 系列)
  • 型号示例:MAX6816EUS+T(订购时请核对完整的订购码、温度等级与封装要求)
  • 在采购前建议参考最新的官方数据手册与封装图,确保引脚定义与焊盘尺寸满足制造与装配要求。

七、总结

MAX6816EUS+T 是一款面向单键/单开关去抖的紧凑型硬件解决方案,适配 2.7V~5.5V 电压平台与工业级温度范围。通过在硬件层面稳定按键信号,可显著减少软件复杂度、降低 MCU 中断负荷并提高系统对抖动与噪声的容忍度。对于追求小体积、高可靠性的消费电子与工业控制设计,MAX6816EUS+T 提供了一种简单而高效的开关去抖手段。若需更详细的时序、引脚排列与电气特性,请以厂商最新版数据手册为准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.