WMSIC Electronic Components

ADI/LINEAR MAX4071AUA+T MAX4071AUA

ModelMAX4071AUA+T
PackageMSOP-8
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR MAX4071AUA+T
Type
ADI/LINEAR
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
MAX4071AUA+T
Electronic Component
100V/V;50V/V
Electronic Component
1
Package
MSOP-8
Electronic Component
40kHz;100kHz
Electronic Component
Current Sense Amplifier
Electronic Component
0.21g
Electronic Component
1
Common Mode Voltage
1.35V~24V
Features
Shunt; /;;; Programmable Output Reference Level
Electronic Component
BM0258873066
Operating Temperature
40℃~+125℃
Voltage
±0.3V
Amplifier
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX4071AUA+T 产品概述

一、简介

MAX4071AUA+T(ADI/Linear 品牌)是一款单通道、双向高侧电流检测放大器,常用于在高电位侧精确测量流经分流电阻(shunt)的电流。器件工作温度范围为-40℃至+125℃,并采用MSOP-8小封装,适合空间受限的嵌入式电源管理和电机驱动应用。作为高侧电流检测器,它把分流电阻两端的微小电压差放大并转换为便于采样的单端电压输出,便于后端ADC或比较器处理。

二、主要特性(功能概览)

  • 单路(单通道)电流感应放大器,支持双向电流检测(正/负方向均可测量)。
  • 高侧感测架构,能够在被测电源侧(高电位)直接测量,无需将负载接地端改动。
  • MSOP-8 封装,适合PCB密集布线与小型化设计。
  • 宽工作温度:-40℃ ~ +125℃,满足工业级环境要求。
  • 输出易于与微控制器/ADC接口,通常通过外部参考(VREF)实现双向零点偏置。
  • 低偏移与低温漂设计(为精确测量提供基础),可实现较小分流电阻以降低功耗和热量。

三、典型应用场景

  • 电池管理系统(BMS):充放电电流监控与均衡策略。
  • 电源管理与负载监控:服务器、通信设备和工业电源的实时电流测量。
  • 马达与驱动控制:直流电机、电机驱动器的瞬态电流与过流保护。
  • 功率计量与能耗监测:采集用电数据用于节能或计费场景。
  • 逆变器与电源转换器中的电流回路监测与保护。

四、设计要点与使用建议

  • 分流电阻选型:兼顾测量精度与功耗,尽量选择低温漂低阻值分流器;计算输出时常用公式为 VOUT = VREF + Gain × VSHUNT(双向测量时VREF设为中点电压)。
  • 共模电压与摆幅:注意器件的共模输入范围(请参考数据手册确认具体数值),确保在整个工作条件下放大器输入不会进入非线性区域。
  • 布局与接地:分流电阻靠近放大器输入并采用Kelvin走线,最小化寄生电阻与干扰;输出侧走线应屏蔽噪声源,减小误差。
  • 去耦与滤波:在VCC与VREF处并靠近器件放置适当旁路电容;在输出到ADC之间可加小RC滤波以抑制高频噪声。
  • 热管理:高电流下分流电阻和周边走线会发热,评估热路径以避免温漂影响测量精度。
  • 校准与软件处理:系统级可在出厂或上电后通过软件校准偏置和增益误差,提高长期精度。

五、封装与可靠性

MSOP-8 小封装便于在空间受限的电路板上部署。器件工业级温度范围(-40℃至+125℃)适合大多数工业和汽车类应用。实际设计中还应查阅ADI/Linear的完整数据手册,了解典型电气参数、输入共模范围、增益、带宽、失调电压、封装引脚功能和热阻等具体指标,以确保在目标应用下达到预期性能与可靠性。

(注:本文为产品概述与设计指导摘要,具体电气参数与典型电路请参阅官方数据手册与器件应用笔记。)

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