WMSIC Electronic Components

ADI/LINEAR AD9767ASTZRL

ModelAD9767ASTZRL
PackageLQFP-48
BrandADI/LINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ADI(Analog Devices) / LINEAR AD9767ASTZRL
Type
ADI/LINEAR
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ADI(Analog Devices) / LINEAR
Electronic Component
AD9767ASTZRL
Electronic Component
1
Package
LQFP-48
Electronic Component
DAC IC
Electronic Component
0.281g
Electronic Component
1
Channel Count
2
Features
Programmable;; Output; Built-in Reference
Electronic Component
BM0264888636
Operating Temperature
40℃~+85℃
Operating Voltage
3.3V~5V
Electronic Component
35ns
Interface Type
Electronic Component
Electronic Component
125MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AD9767ASTZRL 产品概述

一、产品简介

AD9767ASTZRL 是 ADI/Linear 推出的一款高性能 14 位双通道数模转换器(DAC),封装为 48 引脚 LQFP(7 mm × 7 mm)。器件支持并行数字接口,工作电压范围 3.3 V 至 5 V,更新速率可达 125 MHz,建立时间(settling time)为 35 ns,适用于对动态性能与通道一致性有较高要求的高速模拟输出场景。

二、主要规格

  • 分辨率:14 位
  • 通道数:2 路(差分输出)
  • 接口类型:并行数字接口
  • 工作电压:3.3 V ~ 5 V
  • 更新速率:125 MHz
  • 建立时间:35 ns
  • 积分非线性(INL):1.5 LSB
  • 静态电流(典型):8 mA
  • 工作温度:-40 ℃ ~ +85 ℃
  • 功能:可编程增益、掉电模式、差分输出、内置基准源
  • 封装:LQFP-48(7×7 mm)
  • 品牌:ADI / Linear

三、功能特性与优势

  • 高分辨率与较低 INL:14 位分辨率结合 1.5 LSB 的积分非线性,保证了良好的静态线性度,适合精密模拟信号生成与校准场景。
  • 双通道差分输出:提供高共模噪声抑制能力,便于与差分信号链(例如高速差分放大器、变换电阻网络)配合使用,提升抗干扰性能与动态行为。
  • 可编程增益与内置基准:器件自带参考并支持增益编程,简化系统设计与初始调试;同时也支持外部参考以获得更高精度或低漂移需求。
  • 低功耗运行与掉电模式:典型静态电流约 8 mA,提供掉电模式以降低系统待机能耗,适用于电源受限的应用。

四、典型应用

  • 通信领域:本振/基带波形产生、数字上变频器(DUC)前端模拟回放等。
  • 仪器仪表:高速数据采集卡的模拟输出、示波器/信号发生器的精密波形源。
  • 工业与测试系统:闭环控制、标定源、精密控制信号产生。
  • 混合信号系统:与 FPGA/ASIC 并行接口结合实现低延迟、高吞吐量的数据传输和输出控制。

五、设计要点与布局建议

  • 电源与旁路:对 VCC 与参考电源进行多点去耦,关键去耦电容(如 0.1 µF 与 10 µF)应贴近器件电源引脚和参考引脚,减小寄生感抗。
  • 地线与分离:数字地与模拟地建议分开布线并在单点处连接,减少数字切换噪声对模拟输出的干扰。
  • 差分走线:差分输出与负载电阻(或差分放大器输入)间应保持差分线对长度一致、阻抗匹配,避免不必要的反射与失衡。
  • 引脚保护与信号完整性:并行接口的高频数字输入需控制上升/下降时间并视情况加串联阻抗以抑制 ringing。
  • 热管理:LQFP-48 封装需注意布局空间与散热路径,若长时间高速运行建议在 PCB 层间设计适当散热通路并避免热源直接叠加。
  • 电源/参考上电顺序:遵循器件规格书建议的电源与参考上电流程,确保参考稳定后再上数字时钟与输入,以免产生输出错误或锁定问题。

六、封装与可靠性

LQFP-48(7×7 mm)封装适合常规 SMT 生产工艺,便于与 FPGA/微控制器或其他逻辑器件密集布局。器件工作温度范围宽(-40 ℃ 至 +85 ℃),适合工业级应用。具体的焊接与回流工艺,请参考厂商的封装与可靠性说明。

七、采购与参考资料

欲进行产品选型或样片评估,请参考 ADI 官方资料页与器件数据手册(Datasheet),获取完整电气特性、典型应用电路、引脚说明及评估板信息。若有特定系统集成问题,可联系 ADI 支持或当地代理获取参考设计与评估板。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.