Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
AOS AOTS21115C
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- AOS AOTS21115C
- Type
- AOS
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- AOS
- Electronic Component
- AOTS21115C
- Electronic Component
- 1
- Package
- TSSOP-6
- Electronic Component
- 1 P
- Electronic Component
- MOSFET
- Electronic Component
- 0.045g
- Electronic Component
- 1
- Electronic Component
- BM69415007
- Operating Temperature
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 20V
- Capacitor(Ciss)
- 930pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AOTS21115C 产品概述
一、产品基本信息
AOTS21115C 是一款高性能的 P 型场效应管（MOSFET），适用于各种高效能电源管理和信号切换应用。该器件在封装上采用了 TSSOP-6 封装形式，具有典型的低直流电阻和品质优秀的开关特性，适合用于需要低功耗和高效率的电路设计中。其额定功率为 2.5W，最大耐压为 20V，最大电流可达 6.6A。作为 AOS 品牌的一员，AOTS21115C 在市场上以其出色的性能和稳定的品质赢得了良好的声誉。
二、主要特性
低导通电阻：AOTS21115C 的低 R_ds(on) 值使其在工作时的能量损耗降至最低，能够有效提升电源的工作效率。这一特性在开关电源和 DC-DC 转换器中显得尤为重要，有助于延长设备的使用寿命。
高电流能力：这款 MOSFET 最高支持 6.6A 的连续工作电流，使其非常适合于大电流应用，如电机驱动、负载开关等场景。
宽工作温度范围：产品可在较宽的温度范围内工作，确保其在变化环境中保持稳定的性能，非常适合工业自动化、消费电子以及汽车电子等领域。
简易驱动：MOSFET 的门极驱动电平相对较低，方便与微控制器或其他逻辑电平电路集成，提升整个系统的设计灵活性。
节省空间的封装：TSSOP-6 小型封装可以有效节省 PCB 空间，特别适合空间有限的应用场合，如便携式设备和嵌入式系统。
三、应用领域
AOTS21115C 的高效性能和多功能特点使其在多种应用中表现出色：
电源管理：适用于开关电源、线性稳压器和 DC-DC 转换器等电源转换和管理电路，能够实现更高的电源效率。
电机驱动：在直流电机和步进电机的驱动应用中，该 MOSFET 能提供快速、可靠的开关控制，提升电动机的性能。
负载开关：广泛用于负载控制电路，如电池供电设备的开关管理，能够有效控制设备的通断。
消费电子：例如 LED 驱动、音频放大器等，助力提供更加高效和稳定的性能。
四、技术规格
- 型号: AOTS21115C
- 类型: P 型 MOSFET
- 最大功耗: 2.5W
- 最大漏源电压 (V_ds): 20V
- 最大漏电流 (I_d): 6.6A
- 封装类型: TSSOP-6
- 材料: 硅（Silicon）
五、竞争优势
AOTS21115C 在市场上有着显著的竞争优势。首先，其性能参数优越，特别是其低导通电阻和高电流能力，使其在多种高要求的场合中表现出色。此外，AOS 品牌的信誉为产品质量提供了强有力的保障，企业和设计者在选择该元器件时可以放心。
由此，AOTS21115C 适合广泛的电子设计项目，从高端专业应用到日常消费电子设备，均可以有效提升系统的整体性能，减少能耗，提高效率，最终为用户提供更加出色的使用体验。对于追求高效率与高可靠性的电路设计师而言，选择 AOTS21115C 是一个明智的决策。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
