WMSIC Electronic Components

AOS AO6401A

AOS AO6401A
1 / 3

Product image

ModelAO6401A
PackageTSOP-6
BrandAOS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
AOS AO6401A
Type
AOS
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
AOS
Electronic Component
AO6401A
Electronic Component
1
Package
TSOP-6
Electronic Component
1 P
Electronic Component
MOSFET
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0000279415
Power Dissipation(Pd)
2W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V
Capacitor(Ciss)
645pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AO6401A 产品概述

一、产品简介

AO6401A 是由 AOS 品牌推出的一款 P沟道场效应管（MOSFET），其设计旨在实现高效能的电源管理与开关控制。该器件具有较低的导通电阻和较高的电流承载能力，使其广泛应用于各种电源转换和负载开关应用场合。AO6401A尤其适合高效能的负载驱动，如电池管理系统、DC-DC 转换器、以及其他需要高效功率管理的电子设备。

二、基础参数

  1. 漏源电压（Vdss）: 30V

    • 表示该器件在工作状态下可以承受的最大漏源电压，这一参数使得AO6401A可以在中等电压应用中保持良好的稳定性。

  2. 连续漏极电流（Id）: 5A（25°C 时）

    • 此参数表明器件在25°C的环境温度下，可以持续承载的最大电流，适合用于需要高电流输出的场景。

  3. 栅源极阈值电压: 1.3V @ 250uA

    • 栅源极阈值电压是控制MOSFET开启和关闭的关键参数。较低的阈值电压使得AO6401A能够在较低的信号电压下有效工作，可以与多种逻辑电平兼容。

  4. 漏源导通电阻: 47mΩ @ 5A, 10V

    • 漏源导通电阻是影响MOSFET效率的重要因素。AO6401A在5A电流和10V驱动电压下的导通电阻仅为47毫欧，这表明其在导通状态下具有很小的能量损失，能有效降低发热和提高总体系统效率。

  5. 最大功率耗散（Ta=25°C）: 2W

    • 该参数指明在25°C的环境下器件可以安全耗散的最大功率。这使得AO6401A在多种应用中具有良好的热管理性能。

  6. 封装类型: TSOP-6

    • TSOP-6封装意味着该器件体积小，适合于空间受限的应用，使其能够嵌入到紧凑型电路板设计中。该封装的特点还有助于提高电气性能，减小寄生电感和电阻。

三、应用场景

AO6401A 可广泛应用于以下场景：

  1. 电源管理系统: 由于其较低的导通电阻和高电流承载能力，AO6401A适合于各种电源管理电路，如DC-DC转换器、甲醇电池供电系统等。

  2. 负载开关: 该MOSFET能够高效控制负载的开启与关闭，适用于不同类型的电动机驱动、LED驱动等。

  3. 智能家居设备: 低阈值电压的特性使得AO6401A能够与微控制器及逻辑电平信号相兼容，适合在智能家居系统中的开关控制应用。

  4. 便携式设备: 由于AO6401A具有体积小且功率损耗低的特点，非常适合用于便携式设备和计算机外设中，以延长电池寿命。

四、总结

AO6401A作为一款高性能的P沟道MOSFET，凭借其卓越的电气性能和小型化设计，在现代电子设备中扮演着至关重要的角色。无论是在电源管理、负载开关还是在智能家居设备中，AO6401A都能够提供稳定且高效的解决方案。此产品的推出为设计工程师提供了更多的灵活性和设计便利，进一步提升了电子系统的整体性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.