WMSIC Electronic Components

AOS AON3818

ModelAON3818
PackageDFN3x3-8L
BrandAOS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AOS AON3818
Type
AOS
Minimum package
5000

Technical parameters

Electronic Component
AOS
Electronic Component
AON3818
Electronic Component
1
Package
DFN3x3-8L
Electronic Component
2 N
Type
N
Electronic Component
MOSFET
Electronic Component
Electronic Component
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0263433056
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.7W
Electronic Component
5000
Voltage(Vdss)
24V
Capacitor(Ciss)
840pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AON3818 产品概述

一、产品简介

AON3818 是 AOS 推出的双通道 N 沟道场效应管,封装为 DFN3x3-8L,两个晶体管为“共漏”(Drain 共联)配置。器件额定漏源电压 Vdss 为 24V,单通道连续漏极电流 Id 为 8A,适合中低压、高电流的便携与板载电源管理场景。

二、主要电气参数

  • Vdss:24V
  • 连续漏极电流 Id:8A(单通道)
  • 导通电阻 RDS(on):21mΩ @ Vgs=2.5V
  • 耗散功率 Pd:2.7W(无额外散热)
  • 阈值电压 Vgs(th):典型 1.2V
  • 总栅极电荷 Qg:15nC @ 4.5V
  • 输入电容 Ciss:840pF;输出电容 Coss:210pF;反向传输电容 Crss:205pF

三、封装与热性能

DFN3x3-8L 小型封装有利于 PCB 面积节省,但器件 Pd=2.7W 为无额外散热条件下的功耗,实际应用中需通过底部散热垫和多孔热 vias 将热量传导至大面积铜箔以降低结温,确保长期可靠性。工作温度范围为 -55℃ ~ +150℃。

四、应用场景

适用于便携设备电源路径开关、负载开关、电池保护与电源管理、电机驱动的低压分支、同步整流与电流旁路等场合。较低的 RDS(on) 与中等 Qg 使其在低压直流开关与开关转换中效率较高,适合 2 节锂电池系统或 24V 以下的DC电源模块。

五、使用建议与布局要点

  • 门极驱动:2.5V 可获得低 RDS(on),若用于高速开关建议使用 4.5V 门极驱动以缩短开关时间,但会增加栅极损耗。
  • PCB 布局:门、源引线尽量短,采用独立回流平面;底部热垫并配多孔热 vias。
  • 去耦与抑振:开关回路加足够的输入输出去耦电容,门极加阻尼电阻以抑制振铃与电磁干扰。
  • 并联与保护:若需更高电流,可并联(注意匹配热阻与分流);在高 dv/dt 环境下注意 Crss 导致的误触发,必要时并联栅-源电阻或使用栅极驱动器带 Miller 抑制。

六、选型与注意事项

AON3818 在尺寸与性能之间取得平衡,适合对 PCB 面积与功耗有要求的中低压功率开关。选型时注意热设计能力与栅驱电压匹配,以及共漏结构对电路拓扑的限制(Drain 共联会影响某些半桥或串联方案的实现)。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.