Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
AOS AOSS32136C
Configuration
1 options
Configuration
19+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- AOS AOSS32136C
- Type
- AOS
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- AOS
- Electronic Component
- AOSS32136C
- Electronic Component
- 1
- Package
- SOT-23-3
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.059g
- Electronic Component
- 1
- Electronic Component
- BM69415006
- Operating Temperature
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 20V
- Capacitor(Ciss)
- 660pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AOSS32136C 产品概述
AOSS32136C 是一款高性能的 N 沟道金属氧化物半导体场效应管（MOSFET），专为满足各种电子应用中的高效能和高可靠性需求而设计。这款 MOSFET 采用表面贴装型（SMD）封装，方便在现代生产环境中进行自动化焊接，其紧凑的 SOT-23 封装使其适合空间受限的应用场合。
基本参数
AOSS32136C 的主要电气特性如下：
- 最大漏电流（Id）: 6.5A，在 25°C 环境温度下，能够提供足够的电流支持各类电子电路。
- 漏源电压（Vdss）: 20V 使其适合用于低压驱动场合，确保能够应对多种电源配置。
- Rds(on)（导通电阻）: 在 6.5A 和 4.5V 条件下，导通电阻的最大值为 20 毫欧，表明该 MOSFET 在正常工作状态下能够有效减少功耗，提高能效。
- 栅极电荷（Qg）: 最大值为 14nC（在 4.5V 条件下），这意味着开关速度较快且在高频应用中表现良好。
- 输入电容（Ciss）: 在 10V 下最大为 660pF，表明其对于高频信号的响应能力良好。
- 栅源电压（Vgs）: 该产品支持±12V 的栅极驱动电压，为系统设计提供更大的灵活性。
- 导通阈值电压（Vgs(th)）: 最高 1.25V（在 250µA 条件下），允许在更低的栅电压下启动，有利于提高效率。
工作温度与功率性能
AOSS32136C 的工作温度范围为 -55°C 至 150°C，这使得其在各种极端环境条件下都可正常工作。其最大功耗为 1.3W，这个值在一定条件下能够确保良好的散热性能，适合多数要求高效散热设计的电路。
应用领域
这种类型的 MOSFET 广泛应用于以下场景：
- 开关电源：因其高效的导通性能和低的导通电阻，适合用于开关电源管理。
- 电机驱动：在电机控制应用中，能够快速切换，减少电源损耗，提高驱动效率。
- 电池管理系统：由于其较低的功率耗散，适合用于电池供电的设计中，延长设备使用寿命。
- LED 驱动：具备良好的开关能力，适合用于LED照明控制等应用。
- 数据通讯设备：由于其快速的开关特性，适合用于各种数据通讯及信号交换装置。
总结
AOSS32136C MOSFET 以其出色的电气特性和可靠的性能，在当今电子设计中提供了极好的解决方案。无论是高频应用还是需要高效能的电源管理，AOSS32136C 的低导通电阻、宽工作温度范围及强大的开关能力，均使其成为设计师的理想选择。其 SOT-23 封装不仅符合现代电子设计的紧凑需求，还优化了整个电路的板上空间布局，进一步提升了设计的灵活性。总之，AOSS32136C 是广大电子应用设计者在追求高效和高可靠性时的优选元器件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
