Model & package intelligence
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AVX TAJA475K025RNJ
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- AVX TAJA475K025RNJ
- Type
- AVX
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- AVX
- Electronic Component
- TAJA475K025RNJ
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- CASE-A-3216-18(mm)
- Electronic Component
- Capacitor
- Electronic Component
- ±10%
- Electronic Component
- 0.15g
- Electronic Component
- 1
- Electronic Component
- BM0058398725
- Operating Temperature
- 55℃~+125℃
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TAJA475K025RNJ 产品概述
产品介绍
TAJA475K025RNJ 是一款高性能钽电容器，由知名品牌 AVX 生产。该电容器专为要求较高的电子应用而设计，具有出色的稳定性和可靠性，其性能在多种极端工作条件下均能保持卓越。作为一款表面贴装类型的电容器，TAJA475K025RNJ 采用了1206（3216公制）封装，使其非常适合现代电子设备的小型化设计。
主要参数
容值和容差：
- 容值：4.7 µF
- 容差：±10%
额定电压：25V
等效串联电阻（ESR）：
- ESR：3.1 Ω @ 100kHz
工作温度范围：
- -55°C 到 +125°C
尺寸和封装：
- 封装类型：1206（3216公制）
- 尺寸：3.20 mm x 1.60 mm（长度 x 宽度）
- 最大高度：1.80 mm
安装类型：表面贴装型
应用领域
TAJA475K025RNJ 钽电容器适合广泛的应用领域，包括：
- 通信设备
- 汽车电子
- 工业控制
- 计算机和外围设备
- 消费电子产品
- 医疗设备
由于其优越的频率特性和高电压工作能力，该电容器在高频信号处理和电源管理电路中表现尤为突出。其稳定的电容值和低 ESR 特性，确保了在高频工作环境中的高效能和低功耗。
性能优势
高稳定性：钽电容器因其电解质材料的独特性质，能提供优于铝电容器的电容稳定性，尤其在高温、高频条件下表现更为出色。此外，与传统电容器相比，TAJA475K025RNJ 在小尺寸下提供了较大的容量。
宽温工作范围：其工作温度范围从 -55°C 到 +125°C，使其可以在各种极端环境下正常工作，适用于军事、航空航天和工业等严苛条件。
小型化设计：采用1206封装，体积较小，使得在设计高度集成的电路时依然保持良好的电气性能，能够有效节省电路板空间。
选型建议
在选择钽电容器时，用户需考虑产品的额定电压和工作环境等因素。对于TAJA475K025RNJ，其25V的额定电压适合大多数低压电源应用。同时，因该电容器具有较低的 ESR，使其在高频滤波和储能应用中特别有效。
结论
TAJA475K025RNJ 是一款极具竞争力的钽电容器，凭借其出色的性能、广泛的应用性和可靠的生产工艺，成为许多电子设计师的首选。其稳定的电气性能、长寿命及小型封装均为适应现代电子设备不断提升的技术要求提供了有力支持。选择 TAJA475K025RNJ，将意味着在电子设计中拥有了更高的设计自由度和组件可靠性。
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