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AVX TAJB476K006RNJ
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- AVX TAJB476K006RNJ
- Type
- AVX
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- AVX
- Electronic Component
- TAJB476K006RNJ
- Electronic Component
- 1
- Electronic Component
- 47uF
- Package
- CASE-B-3528-21(mm)
- Electronic Component
- Capacitor
- Electronic Component
- ±10%
- Electronic Component
- 0.106g
- Electronic Component
- 1
- Electronic Component
- BM69415273
- Operating Temperature
- 55℃~+125℃
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TAJB476K006RNJ 产品概述
1. 产品简介
TAJB476K006RNJ 是一款高性能钽电容，由知名电子元器件制造商 AVX 生产。它采用表面贴装型设计，具备良好的电气特性和稳定性，广泛应用于各种电子设备中。该钽电容的额定电压为6.3V，电容量为47µF，适用于需要高密度和高可靠性的电路。
2. 关键参数
- 电容值: 47µF——具有出色的能量储存能力，适应多种电源管理和滤波电路。
- 额定电压: 6.3V——确保在日常电子设备中能够可靠工作，适合用于低压及中压电路。
- 容差: ±10%——保证了电容值的一致性和可预测性，满足不同电路设计的要求。
- ESR（等效串联电阻）: 2Ω@100kHz——低ESR特性让它在高速信号应用中表现优异，减少了功率损耗。
- 工作温度范围: -55°C ~ 125°C——适合极端环境下使用，提供了可靠的运行保障。
3. 尺寸与封装
TAJB476K006RNJ 采用 CASE-B 封装，具体尺寸为 0.138" (长) x 0.110" (宽) x 0.083" (高)（约 3.50mm x 2.80mm x 2.10mm）。这种紧凑型设计使得其能够在大多数表面贴装技术(SMT)电路板上轻松安装，节省了宝贵的电路板空间。
4. 特性与优势
- 高稳定性: 钽电容以其优异的稳定性和耐久性著称，TAJB476K006RNJ 可以在高温和高频应用中保持稳定性能，降低故障率。
- 广泛的应用领域: 由于其良好的电气特性，TAJB476K006RNJ 可广泛应用于消费电子、汽车电子、通讯设备、工业设备等领域，特别适合用于电源滤波和去耦。
- 高密度设计: 结合其小巧的封装设计，能够在电子设计中实现高密度布局，满足当今电子产品对小型化和轻量化的需求。
5. 应用场景
TAJB476K006RNJ 钽电容能够适用于各种电子电路，包括但不限于：
- 电源管理: 在DC/DC转换器、电源滤波器和稳压器中用于能量存储和去耦电容功能。
- 信号去耦: 在高频电路中为微处理器和其他敏感元器件提供净化的电源，防止信号干扰。
- 滤波器设计: 在音频和视频设备中作为输入和输出滤波器，提升信号质量。
6. 总结
TAJB476K006RNJ 是一款具有卓越性能的钽电容，凭借其小巧的体积、优秀的电气性能以及适应极端工作环境的能力，为电路设计提供了广泛的灵活性。作为 AVX 制造的优质产品，TAJB476K006RNJ 是高性能电子应用中理想的选择，有助于满足现代电子设计对高度集成和稳定性的要求。
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