Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
AVX TAJA475K020RNJ
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- AVX TAJA475K020RNJ
- Type
- AVX
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- AVX
- Electronic Component
- TAJA475K020RNJ
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- CASE-A-3216-18(mm)
- Electronic Component
- Capacitor
- Electronic Component
- ±10%
- Electronic Component
- 0.15g
- Electronic Component
- 1
- Electronic Component
- BM0000286497
- Operating Temperature
- 55℃~+125℃
- Voltage
- 20V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TAJA475K020RNJ 产品概述
产品简介
TAJA475K020RNJ 是由 AVX Corporation 生产的一款高性能钽电容器，属于 TAJ 系列。该电容器是表面贴装型（SMD），具有4.7μF的电容值和20V的额定电压，适用于多种电子设备和电路。
核心参数
- 电容值: 4.7μF
- 额定电压: 20V
- 精度和容差: ±10%
- 等效串联电阻（ESR）: 4Ω @ 100kHz
- 工作温度范围: -55°C 到 +125°C
- 封装类型: 1206 (3216 公制)
- 尺寸: 3.20mm x 1.60mm x 1.80mm (长 x 宽 x 高)
- 包装形式: 卷带（TR）
设计特点
TAJA475K020RNJ 的设计让它具备了良好的热稳定性和高频特性，适用于处理高频信号的电路。其低 ESR 值使其在高频应用中能够更好地工作，从而减少能量损耗和热量生成。此外，其宽广的工作温度范围使其能够在极端的环境条件下正常工作，提供了高度的可靠性。
应用场景
该钽电容器广泛应用于消费电子、工业设备、汽车电子和其他多种电子设备中。由于其小型化和高容量的特点，特别适合用于空间受限的应用场合，如：
- 智能手机和便携式设备
- 嵌入式系统
- 电源管理模块
- 高频通讯设备
- 医疗设备
可靠性与稳定性
AVX Corporation 是全球领先的电子元器件制造商，其产品拥有严苛的质量控制标准，TAJA475K020RNJ 作为一款高品质的钽电容器，具备卓越的电气性能和长久的使用寿命。电容器经过严格测试，确保在其规格条件下可以长时间高效运行，能够满足现代电子设备对长期稳定性和高可靠性的需求。
性能优势
- 优异的频率特性: 低 ESR 的设计对于高频应用十分重要，能够有效降低信号失真和电源噪声。
- 小型化设计: 随着现代电子设备对空间的要求越来越高，TAJA475K020RNJ 的1206封装尺寸非常适合各种紧凑型设计。
- 广泛的工作温度范围: -55°C 到 +125°C 的工作温度范围，使得该款电容器可以在各种厄运环境中正常工作，非常适合要求高的工业应用。
- 高可靠性: AVX的专业制造工艺，确保产品在使用过程中的可靠性，减少了维修和更换的需求。
安装与兼容性
TAJA475K020RNJ 钽电容器采用流行的 SMD 安装方式，兼容广泛的印刷电路板（PCB）设计。这种优势使得设计师和制造商可以方便地在电路中集成此电容器，降低了生产流程的复杂性。
结论
综上所述，TAJA475K020RNJ 是一款功能强大、可靠性高的钽电容器，特别适用于现代电子设备的电路设计。凭借其卓越的电气性能和小型化设计，该电容器在多种应用场合中均表现出色。无论是在消费电子、工业设备还是在高频通信领域，TAJA475K020RNJ 都能为设计师提供极大的灵活性和性能保障，是一款值得推荐的优质元器件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
