WMSIC Electronic Components

AVX TAJC225K035RNJ

ModelTAJC225K035RNJ
PackageCASE-C-6032
BrandAVX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
AVX TAJC225K035RNJ
Type
AVX
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AVX
Electronic Component
TAJC225K035RNJ
Electronic Component
1
Electronic Component
2.2uF
Package
CASE-C-6032
Electronic Component
Capacitor
Electronic Component
±10%
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0229956457
Voltage
35V
Electronic Component
Electronic Component
Electronic Component
500
Resistor(ESR)
3.5Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAJC225K035RNJ 产品概述

一、概览

TAJC225K035RNJ 为 AVX 公司生产的钽电容器(C 型,封装 CASE‑C‑6032),标称电容值 2.2 µF,容差 ±10%,额定电压 35 V。器件采用固体钽电解质结构,适用于对体积、稳定性和长期可靠性有要求的直流整流、去耦与滤波场合。工作温度范围为 −55 ℃ 至 +125 ℃,对工业级、汽车电子等高温环境具有良好适应性。

二、主要参数

  • 电容值:2.2 µF(±10%)
  • 额定电压:35 V
  • ESR(等效串联电阻):3.5 Ω(典型/量测条件请参照厂方数据表)
  • 工作温度:−55 ℃ ~ +125 ℃
  • 封装:CASE‑C‑6032(通用贴片钽电容外形)
  • 品牌/系列:AVX,产品型号 TAJC225K035RNJ

三、性能特点与优势

  1. 高体积比电容:钽电容在相同比例下能提供较高的电容量,有助于在受限 PCB 面积下实现有效去耦与滤波。
  2. 宽温度范围与稳定性:在 −55 ℃ 至 +125 ℃ 范围内电容值与损耗表现稳定,适合工业与高温场景。
  3. 固体电解质可靠性:固体钽电容具有较长的寿命与良好的漏电流特性(具体漏电流请参照完整数据表)。
  4. 标准化封装便于自动贴装(SMT),CASE‑C‑6032 为常用的中型贴片尺寸,利于批量生产与装配一致性。

四、应用场景

  • 电源去耦与稳压器输出滤波(DC‑DC、LDO 输出侧)
  • 功率管理与缓冲(需注意电压冲击与浪涌电流)
  • 工业控制、通信设备、消费类电子的中频滤波与旁路应用
  • 对体积与稳定性要求较高的嵌入式系统电源设计

五、设计与使用建议

  1. 极性注意:钽电容为极性元件,必须正确极性安装,反向施加电压会导致损坏甚至短路。
  2. 电压降额建议:为延长使用寿命并降低故障风险,设计时常建议对钽电容进行额定电压降额(例如不长期以满额定电压工作)。具体降额比例请依据系统容忍度与可靠性要求确定。
  3. 浪涌与冲击电流:钽电容对浪涌电流较敏感,避免在无限流保护下直接承受高突发电流;必要时可并联低阻抗陶瓷电容或在电路中加入限流元件。
  4. ESR 与热耗:该型号 ESR 为 3.5 Ω,较高的 ESR 会限制允许的纹波电流并产生额外发热,设计时应评估纹波电流与功耗,必要时考虑并联多颗电容以降低等效 ESR。

六、封装与焊接注意

  • 封装 CASE‑C‑6032 适用于回流焊工艺。焊接时应遵循 AVX 或行业推荐的回流温度曲线,避免过高峰值温度和过长加热时间,以免影响电容性能与寿命。
  • 存储与贴装前应按湿敏等级(MSL)处理,若厂家给出干燥与回流前烘烤要求请遵守,以减少焊接期间产生的缺陷。

七、可靠性与检验

TAJC225K035RNJ 属固体钽产品,通常需关注高温长期老化、耐压测试和焊接后性能保持。生产与设计环节应做必要的样件测试(如高温老化、耐压、振动与热循环)以验证在目标应用中的可靠性。

如需完整电气特性曲线、失效率数据或回流焊工艺参数,请参考 AVX 官方数据手册或联系供应商获取 TAJC225K035RNJ 的详细规格表。

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