Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
AVX F931C226MAA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- AVX F931C226MAA
- Type
- AVX
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- AVX
- Electronic Component
- F931C226MAA
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- SMD
- Electronic Component
- Capacitor
- Electronic Component
- ±20%
- Electronic Component
- 0.067g
- Electronic Component
- 1
- Electronic Component
- BM0257629079
- Operating Temperature
- 55℃~+125℃
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
- Resistor(ESR)
- 3Ω@100kHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AVX F931C226MAA 钽电容器产品概述
一、概述
AVX F931C226MAA 为表面贴装固体钽电容器，标称容值 22µF，公差 ±20%，额定电压 16V。器件为 1206 封装（约 3.2 × 1.6 mm），适用于对体积、稳定性和温漂有要求的电源旁路、滤波与去耦场合。该型号在宽温度范围内（-55℃ 至 +125℃）保持良好的电气特性，ESR 标称值为 3Ω（测试条件 100kHz），适合中低频去耦和能量缓冲用途。
二、主要电气参数
- 容值：22 µF
- 容值公差：±20%
- 额定电压：16 V
- 等效串联电阻（ESR）：3 Ω @ 100 kHz
- 工作温度范围：-55 ℃ ~ +125 ℃
- 封装形式：SMD 1206
- 品牌：AVX
三、性能特点
- 体积小、容值高：在 1206 小封装中提供 22µF 容量，有利于 PCB 布局密集的现代电子产品。
- 宽温适应性：-55℃~+125℃ 的工作范围满足工业级与消费电子的多种环境需求。
- 稳定滤波性能：较低的 ESR 在多种频段能提供稳定的去耦和滤波效果，有助于降低电源噪声。
- 兼容 SMD 工艺：适用于常规回流焊工艺，便于自动化贴片生产。
四、使用注意事项
- 极性识别：固体钽电容为极性器件，使用时必须严格按电路标注安装，反向电压可能导致损坏甚至失效短路。
- 电压与浪涌：推荐对额定电压进行适当降额（常见实践为 50%~80%）以提高寿命和可靠性，避免高幅值浪涌电流直接施加到器件上。对可能出现的突波建议加限制电阻或浪涌抑制电路。
- 温度与寿命：在高温或高电压应力下，钽电容的寿命会缩短；在设计时应留有裕量，并考虑环境散热条件。
- 焊接与存储：遵循 AVX 建议的回流焊温度曲线和湿度控制措施（若购自带湿敏包装），避免长时间在高温高湿环境中保存。
五、典型应用场景
- 电源去耦与旁路：用于 MCU、ASIC 等数字电路附近做局部去耦，改善瞬态响应。
- 模拟电路滤波：在模拟前端、音频放大器等需要稳定滤波的电路中发挥作用。
- 工业与通讯设备：因温度范围宽、体积小，适合嵌入式控制、通信模块与便携设备的电源子系统。
六、可靠性与选型建议
在关键应用中建议结合实测数据与系统级安全裕度选择器件。对于有较高浪涌或反复充放电的场合，可考虑串联限流元件或使用更高额定电压/更低 ESR 的器件以提升可靠性。采购时关注出货批次的湿敏等级和封装完整性，安装前按厂商资料做好预热与回流参数控制。
如需更详细的规格曲线、机械尺寸图或焊接建议，请参考 AVX 官方数据手册或联系供应商索取完整技术资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
