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AVX TPSB336K016R0500
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- AVX TPSB336K016R0500
- Type
- AVX
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- AVX
- Electronic Component
- TPSB336K016R0500
- Electronic Component
- 1
- Electronic Component
- 33uF
- Package
- CASE-B-3528-21(mm)
- Electronic Component
- Capacitor
- Electronic Component
- ±10%
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0229956458
- Operating Temperature
- 55℃~+125℃
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TPSB336K016R0500 产品概述
一、产品基本参数
TPSB336K016R0500 为 AVX 品牌的固体钽电容，主要电气和机械参数如下：
- 容值：33 µF
- 额定电压：16 V
- 容差：±10%
- 等效串联电阻（ESR）：500 mΩ @ 100 kHz
- 工作温度范围：-55 ℃ ～ +125 ℃
- 封装：CASE-B（对应 3528 级封装尺寸）
该器件为极性（有极）钽固体电容，适用于需稳定容量与高可靠性的电子电路。
二、主要特点与优势
- 温度适应性强：-55 ℃ 至 +125 ℃ 的工作范围适合工业级和军工级温度要求。
- 容量稳定：固体钽电容在温度、时间及偏压下比部分电解电容表现更稳定，适合滤波和旁路场合。
- 体积小、集成度高：CASE-B（3528）封装在单位体积内提供较大容值，有利于空间受限的 PCB 布局。
- 可控 ESR：500 mΩ 的 ESR 在中低频去耦与纹波吸收上具有可预测的发热和效率特性。
三、典型应用场景
- DC-DC 转换器输入/输出纹波抑制与瞬态响应优化；
- 工业控制、汽车电子（需注意额外的电压降额及浪涌保护）；
- 通讯设备、仪器仪表中的旁路与去耦；
- 需要长期稳定容量与温度耐受性的嵌入式供电模块。
四、封装与安装注意事项
- 极性标识：钽电容为极性器件，装配时务必确认正负极，避免反接造成失效甚至起火。
- 焊接工艺：遵循 AVX 推荐的回流曲线，避免过高的峰值温度及超时预热，防止内部材料退化。
- PCB 布局：尽量靠近电源引脚放置以缩短信号回路，减少寄生感抗和散热集中。
- 机械应力：避免贴片过程中对封装施加过大弯曲或剪切力，防止内部断线。
五、可靠性与使用建议
- 降额使用：为延长寿命并降低失效率，建议在设计中对额定电压进行适度降额（例如按具体应用环境考虑 50%~80% 的实用电压范围）。
- 防浪涌措施：钽电容对反向和大电流冲击敏感，建议在可能出现浪涌或反向电压的回路中加串联限流、电阻或保护二极管。
- 测试与验收：进行常温及高低温循环、ESR/容量测量及冲击、振动测试以验证在目标工作环境下的可靠性。
六、选型参考
当系统需要在受限空间内获得较大容量且要求在宽温范围内具有长期稳定性时，TPSB336K016R0500 是可靠的选择。若对超低 ESR、超高频去耦有更苛刻要求，可同时评估陶瓷多层电容或铝电解/聚合物电容的混合配置，以兼顾瞬态响应与总能量储备。
总结：TPSB336K016R0500 以其稳定的容量、工业级温度适应性与紧凑封装，适合中等频段去耦与稳压滤波等应用，但需在电压降额、防反接及热管理上做好设计验证以保障长期可靠性。
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