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AVX 0603YD105KAT2A
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- AVX 0603YD105KAT2A
- Type
- AVX
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- AVX
- Electronic Component
- 0603YD105KAT2A
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0254854168
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603YD105KAT2A 产品概述
一、产品简介
0603YD105KAT2A 为 AVX 出品的一款贴片多层陶瓷电容，标称容值 1 μF，容差 ±10%，额定电压 16 V，介质为 X5R，封装为 0603（约 1.6 mm × 0.8 mm）。该系列以体积小、容值大、适配自动化贴装为特点，常用于移动设备与一般电子产品的电源去耦与滤波场合。
二、主要电气特性
- 标称容量：1 μF
- 容差：±10%
- 额定电压：16 V DC
- 介质类型：X5R（属 II 类陶瓷，适用温度范围宽，介电常数较高）
- 封装：0603（SMD）
X5R 型介质在温度与偏压下会产生容值变化；在高工作电压或低温环境下，实际电容可能较标称值下降，设计时需预留裕量。
三、应用场景
适用于各类电源去耦、稳压器输入输出旁路、DC/DC 降压/升压转换器、滤波网络及一般旁路与耦合用途。由于体积小、频率响应好，亦常用于手机、平板、笔记本及物联网终端等空间受限的消费电子产品中。
四、使用与布板建议
- 去耦时建议尽量靠近 IC 电源引脚放置，缩短回流路径以降低 EMI。
- 高频场合可并联多种封装与电容值以获得更优的 ESR/ESL。
- 由于直流偏置效应，若需保证在工作电压下的有效容值，建议在设计时考虑适度降额（根据系统可靠性要求采取 20%–50% 的电压降额策略）。
- 避免贴片后基板弯曲或焊接应力集中，贴片两侧焊盘对称并满足制造商推荐 land pattern。
五、工艺与可靠性
适配常规无铅回流焊工艺（请遵循 AVX 指定的回流温度曲线与焊接要求）。陶瓷电容固有的脆性要求在 PCB 设计与后处理时避免机械冲击及过度清洗化学应力。AVX 产品符合 RoHS 等环保要求，适用于消费与工业级产品设计。
六、选型提示与替代
本型号适合对体积与容值有较高要求但对温度稳定性要求不高的通用去耦场合；若需要极高温度稳定性或精密电容，建议采用 C0G/NP0 类产品。设计时应关注直流偏置与温度依赖对电容有效值的影响，并在电路仿真中考虑实际工作条件下的容量变化。
七、包装与订购
0603YD105KAT2A 一般以卷带（tape & reel）方式包装，适配高速贴片生产线。订购时请核对包装卷盘数量、供货交期与批次，以保证物料一致性与可靠性。若需样品或批量采购，建议联系 AVX 授权代理或经销商获得最新规格书与库存信息。
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