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AVX TPSD337K010R0100
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- AVX TPSD337K010R0100
- Type
- AVX
- Unit
- Electronic Component
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- AVX
- Electronic Component
- TPSD337K010R0100
- Electronic Component
- 1
- Electronic Component
- 330uF
- Package
- SMD
- Electronic Component
- Capacitor
- Electronic Component
- ±10%
- Electronic Component
- 0.422g
- Electronic Component
- 1
- Electronic Component
- BM0257629083
- Operating Temperature
- 55℃~+125℃
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TPSD337K010R0100 产品概述
一、产品简介
TPSD337K010R0100 为 AVX 系列 SMD 钽电容，标称容量 330 µF，容差 ±10%，额定电压 10 V，等效串联电阻（ESR）100 mΩ（@100 kHz），封装 CASE-D-7343。工作温度范围宽（-55 ℃ 至 +125 ℃），体积小、容积效率高，适合对体积与稳定性要求较高的电源去耦与能量储存场景。
二、关键性能与优势
- 高容值：330 µF，在紧凑封装下提供较大电容量，适合板上去耦与滤波。
- 低 ESR：100 mΩ（@100 kHz），有利于降低纹波电压和热损耗，提升开关电源稳定性。
- 宽温区间：-55 ℃ ~ +125 ℃，可应对工业级环境。
- 稳定性好：钽电容长期漂移小，频率特性优于同等体积的电解电容。
- SMD 封装（CASE-D-7343）：便于自动贴装与高密度布局。
三、典型应用场景
- DC-DC 转换器输入/输出端滤波与能量储存。
- 主/次电源轨去耦（CPU、FPGA、电源管理芯片）。
- 通信设备、工业控制与汽车电子等对可靠性有要求的系统（需按具体认证核实）。
四、设计与选型建议
- 电压裕度：钽电容对冲击电流和浪涌较敏感，设计中应保留电压裕度并采取浪涌限制措施；常见做法是在电路中限制充放电电流或加入串阻/保险。
- 纹波与发热：可按 P = I_rms^2 × ESR 估算功耗并评估温升。若纹波电流较大，应选用 ESR 更低或并联多只电容分担。
- 布局：靠近负载或稳压芯片放置，短而宽的回流路径能降低寄生阻抗与电感。参考制造商 PCB pad 与回流规范。
- 温度影响：尽管额定温度高，仍应考虑高温下的容量变化与寿命影响，必要时选择更大容量或更高规格器件。
五、安装与可靠性注意
- 极性明确，钽电容为极性器件，贴装时必须保证正负极正确。
- 遵循制造商的回流焊温度曲线与焊接工艺，避免过度热应力。
- 仓储包装注意防潮与防静电保护，开封后按 MSL 要求及时使用。
- 对关键安全场合，建议结合熔丝或限流保护以降低失效风险。
如需更详细的电气特性表、机械尺寸或推荐的焊接曲线，请提供是否需要原厂数据表，我可为您进一步整理与对比选型建议。
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