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AVX 0402ZD104KAT2A
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- AVX 0402ZD104KAT2A
- Type
- AVX
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- AVX
- Electronic Component
- 0402ZD104KAT2A
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0254854169
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402ZD104KAT2A 产品概述
一、产品简介
0402ZD104KAT2A 是 AVX 品牌的表贴多层陶瓷电容（MLCC），标称容值 100 nF，初始容差 ±10%（K），额定电压 10 V，介质体系为 X5R。封装为 0402（约 1.0 mm × 0.5 mm），适合高密度贴片电路，用于旁路、去耦、储能与滤波等场合。
二、关键电气参数
- 容值：100 nF（0.1 μF）
- 初始容差：±10%（K）
- 额定电压：10 V DC
- 介质：X5R（-55°C 至 +85°C，温度范围内容值变化上限约 ±15%，需参考具体曲线）
- 尺寸：0402（1.0 mm × 0.5 mm，厚度随系列略有不同）
- 封装形式：表面贴装、带卷盘供料
三、性能特点与注意事项
- X5R 介质提供较高的体积比电容，适合在空间受限处实现大容量布置。
- X5R 属电介质随温度和偏置电压（DC bias）会发生容值变化：在额定电压下和较高温度时，实测容值可能显著下降；设计时应参照厂商的容值-偏压和容值-温度曲线，并考虑降额使用以保证裕量。
- MLCC 的等效串联电阻（ESR）和等效串联电感（ESL）较低，适合高频去耦与瞬态冲击吸收，但其自谐频率存在，应根据频谱特性选择并联或分级去耦策略。
四、应用场景
- 电源去耦与旁路（DC-DC 输出、LDO 输入/输出）
- 高频滤波与阻尼网络
- 耦合/去耦在通信、消费电子、便携设备、汽车电子（需确认温度与电压规范）等领域广泛应用
五、封装与工艺建议
- 按照 IPC 推荐的 0402 焊盘尺寸或 AVX 数据手册给出的推荐焊盘布局设计，保证可重复焊接性与焊点可靠性。
- 采用标准回流焊流程（无铅回流峰值温度通常 ≤ 260°C），遵循厂方回流曲线以防裂纹和迁移。
- 贴装时注意基板弯曲和焊膏面积控制，避免过大应力导致电容裂片。0402 尺寸对贴装精度要求高，建议采用自动贴片机并优化取放参数。
- 防静电、防潮存放；若封装为吸湿包装，按厂商规定回流前进行必要的烘烤处理。
六、可靠性与选型建议
- X5R 系列在温度与偏置条件下容值漂移较 C0G/NP0 小，但优于较高介电常数材料的极端不稳定型。关键应用（高精度计时、滤波器）如需容值稳定性，应优先考虑 C0G 型。
- 对于严格的电压裕度或高温工作环境，考虑选用额定电压更高的型号（如 16 V 或 25 V），或在设计中实行电压降额（常见建议为 50% 降额，视应用与曲线决定）。
- 在最终设计前，建议参考 AVX 官方数据手册中的容值-温度、容值-偏压和阻抗曲线，并做实际板级测试验证。
如需该型号的详细电学曲线、封装图纸或推荐焊盘尺寸，可提供进一步需求，我可为您检索并整理 AVX 官方资料与关键应用测试建议。
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