WMSIC Electronic Components

AVX TPSB226K010T0700

ModelTPSB226K010T0700
Package1411
BrandAVX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AVX TPSB226K010T0700
Type
AVX
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AVX
Electronic Component
TPSB226K010T0700
Electronic Component
1
Electronic Component
22uF
Package
1411
Electronic Component
Capacitor
Electronic Component
±10%
Electronic Component
0.105g
Electronic Component
1
Electronic Component
BM0093206413
Operating Temperature
55℃~+125℃
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
2000
Resistor(ESR)
700mΩ@100kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPSB226K010T0700 产品概述

1. 产品简介

TPSB226K010T0700 是一款高级钽电容,由知名电子元器件制造商 AVX 生产,配备了卓越的电气性能和可靠的物理特性。该电容的额定电压为10V,电容量为22µF,且具有 ±10% 的容差。这种钽电容广泛应用于各种电子设备中,特别适合高频和高温环境下的使用。

2. 主要参数

  • 电容量:22µF
  • 容差:±10%
  • 额定电压:10V
  • 等效串联电阻(ESR):700毫欧 @ 100kHz
  • 工作温度范围:-55°C ~ 125°C
  • 安装类型:表面贴装型
  • 封装类型:1411(3528公制)
  • 尺寸:0.138" 长 x 0.110" 宽(3.50mm x 2.80mm)
  • 最大安装高度:0.083"(2.10mm)
  • 特性:通用

3. 设计与封装

TPSB226K010T0700采用了重量轻、体积小的1411封装,使其在现代电子设计中显得尤为重要。该封装的尺寸(3.50mm x 2.80mm)使其非常适合空间要求严格的应用场景。表面贴装的设计方便了自动化生产,提高了组装效率,降低了生产成本。

4. 电气特性

该钽电容具有较低的ESR(700毫欧 @ 100kHz),这使得它在进行高频信号传输时具有较低的能量损耗。低ESR能够有效降低电路中的消耗,避免因能量损耗带来的额外热量,确保电路的稳定性和可靠性。此外,采用钽材料制造,使得该电容的电容量比其他电容(如铝电容)更高,相同体积下可存储更多的电能。

5. 工作温度范围

TPSB226K010T0700的工作温度范围为-55°C到125°C,极大增强了其在极端环境下的适用能力。这使得该电容必然适用于航空航天、汽车电子、工业控制等领域,能够在严苛的工作条件下保持其性能一致性。

6. 应用场景

TPSB226K010T0700适用于多种电子应用场景,特别是在信号处理、滤波、去耦和能量存储方面具有出色表现。其广泛用于消费电子、计算机、通讯设备和工业设备等领域。在需要高频特性和良好温度稳定性的应用中,如DC-DC转换器、音频设备及计算机主板的电源去耦等,TPSB226K010T0700都是理想选择。

7. 结论

总体来看,TPSB226K010T0700是一款具有高稳定性、高耐压、高能量密度的钽电容,适合各种严苛环境下的电子产品使用。无论是在设计、性能还是应用范围上,它都满足了现代电子设备对高品质元器件的需求。AVX作为知名品牌,确保了产品的高可靠性和一致性,使得TPSB226K010T0700成为电子设计工程师的优秀选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.