WMSIC Electronic Components

AVX 04025C102KAT2A

Model04025C102KAT2A
PackageSMD
BrandAVX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 58907

Availability on request

Technical data

Product details

20 specifications

Core information

Product name
AVX 04025C102KAT2A
Type
AVX
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
AVX
Electronic Component
04025C102KAT2A
Electronic Component
1
Electronic Component
1nF
Package
SMD
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.011g
Electronic Component
1
Electronic Component
BM0265736797
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

04025C102KAT2A 产品概述

一、产品基本信息

04025C102KAT2A 为 AVX 品牌的多层贴片陶瓷电容(MLCC),封装为 0402(公制约 1.0 × 0.5 mm),额定电压 50 V,标称电容值 1 nF(102),公差 ±10%(K),介质温度特性为 X7R,表面贴装(SMD)。该型号适合体积受限电路中的旁路、去耦、滤波与耦合等常见应用。

二、关键特性与电气性能

  • 电容:1 nF(102)
  • 公差:±10%(K)
  • 额定电压:50 V DC
  • 介质:X7R(-55°C 到 +125°C 范围内电容变化在 ±15% 以内)
  • 封装:0402 SMD(适用于自动贴装与回流焊工艺)
  • 品牌与质量:AVX,工艺与可靠性符合业界标准

X7R 为类 II 陶瓷材料,具有较高的体积电容密度和稳定的中等温度特性,常用于一般去耦与旁路场合。需要注意 X7R 存在 DC 偏压依赖(在高电压下电容会下降)以及随时间缓慢老化的特性,具体随工作电压与几何尺寸而异,建议参考 AVX 官方数据曲线。

三、应用场景

  • 电源去耦与旁路:靠近芯片电源引脚放置以抑制高频噪声
  • 信号链滤波与耦合:在模拟与数字信号路径中用作交流耦合或低通滤波
  • 高频旁路:由于封装小、寄生电感低,适合高速电路的局部滤波
  • 移动与便携设备:适合对体积和重量有严格要求的消费电子产品

四、PCB 布局与焊接建议

  • 建议采用厂家或 IPC 推荐的焊盘尺寸与过孔布局,确保良好焊接强度与温度循环可靠性。
  • 去耦电容应尽量靠近芯片电源引脚放置,走线最短并通过大量地平面回流,减少串联电感。
  • 回流焊时遵循 AVX 的焊接温度曲线(无铅回流峰值温度通常接近 245–260°C),避免反复高温循环。
  • 避免在板卡加工或装配阶段对焊点附近施加过大弯曲或机械应力,0402 体积小易受挤压导致裂纹。

五、可靠性与注意事项

  • X7R 电容在高电压下会产生一定的 DC 偏压损失,设计时需留有裕量;如对电容精度敏感,应参考 AVX 提供的偏压-电容曲线。
  • MLCC 可能随时间发生老化(电容值逐渐下降),放置期间与长期使用中均应留意这一特性。
  • 小封装器件在焊接与回流过程中对湿度、热循环和机械应力敏感,建议按厂方推荐进行储存与防潮处理,必要时采用回流前烘箱干燥。

六、选型建议

若电路对电容随偏压变化高度敏感或需极高温度稳定性,应考虑使用 C0G/NP0 类型;若空间受限且对容值体积密度有要求,04025C102KAT2A 在多数通用去耦与滤波场合提供了良好的性价比。最终选型前建议查阅 AVX 官方数据页获取完整的电气特性曲线与封装尺寸资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.