Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ALLEGRO A1104EUA-T A1104EUA
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- ALLEGRO A1104EUA-T
- Type
- ALLEGRO
- Minimum package
- 500 袋
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ALLEGRO
- Electronic Component
- A1104EUA-T
- Electronic Component
- 1
- Package
- SIP-3
- Electronic Component
- Hall Switch
- Electronic Component
- 0.136g
- Electronic Component
- 1
- Electronic Component
- BM69418238
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 3.8V~24V
- Operating Current
- 4.1mA
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
A1104EUA-T 产品概述
产品简介
A1104EUA-T是由Allegro MicroSystems制造的一款霍尔效应传感器，采用3-SIP（单列直插封装）形式。作为一种单极开关，该传感器是通过测量磁场的变化实现开关功能的，广泛应用于需要无接触式开关的电子设备中。A1104EUA-T特别适合于位置检测、速度计、以及其他类似应用，在设计上注重了极高的灵敏度和可靠性，尤其在严苛的环境条件下表现出色。
关键规格
- 制造商: Allegro MicroSystems
- 零件状态: 停产（已停产）
- 工作温度范围: -40°C至85°C
- 技术: 霍尔效应
- 极化: 南极
- 感应范围:
- 跳闸：45mT
- 释放：2.5mT
- 电压范围: 3.8V至24V
- 最大供电电流: 7.5mA
- 最大输出电流: 25mA
- 输出类型: 开路漏极
- 封装类型: 通孔 (Through-hole)
- 供应商器件封装: 3-SIP
- 封装外壳: 3-SSIP
性能特点
A1104EUA-T的霍尔效应技术保证了其在非接触式应用中的高效和稳定。其感应范围内的南极磁场能够有效地建立闭合或打开电路，适用于距离传感和位置检测等多种应用场合。传感器在-40°C至85°C的工作温度范围内，能够正常稳定工作，适合多种工业和消费领域的应用。
该传感器的电流供电设计为最大7.5mA，确保了在供电条件较不稳定的情况下，仍然能够保持优异的开启和关闭响应。A1104EUA-T的开路漏极输出类型使其在连接到负载时具备高灵活性，在多个负载情况下均能有效工作。
应用领域
A1104EUA-T因其强大的性能和稳定性，广泛应用于以下领域：
- 汽车电子: 在汽车位置传感器、速度传感器、以及无钥匙启动系统等方面。
- 工业自动化: 用于设备位置检测、感应开关，或控制系统的反馈检测。
- 消费电子: 手机、平板等设备的智能开关以及家电产品的非接触式控制。
- 机器人技术: 关键位置或角度的检测，确保机器人动作的精确性。
设计和安装
A1104EUA-T的通孔设计支持其在印刷电路板（PCB）上的简单安装，这使得集成到现有的电子设备中变得容易。三引脚的结构提供简洁的连线方案，使得设备的设计和维护更加高效。
停产注意事项
虽然A1104EUA-T旨在满足各种应用需求，但由于该型号目前已经停产，设计工程师在开发新产品时需要考虑选用替代方案。在选择替代部件时，需综合考虑感应范围、功耗、工作温度和输出类型等关键参数。
总结
A1104EUA-T是Allegro MicroSystems公司推出的一款高性能霍尔效应传感器，具备显著的感应特点和广泛的应用领域。这款产品无论是在汽车、工业还是消费电子领域，都展现出强大的实用性，尽管现已停产，但在过往的应用中，无疑为众多设计贡献了力量。对设计师来说，理解其性能和特点，将助力在选择合适的替代方案时做出明智的决策。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
