WMSIC Electronic Components

AISHI EGW2WM330W25OT

ModelEGW2WM330W25OT
PackageRADIAL,12.5X25MM
BrandAISHI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AISHI EGW2WM330W25OT
Type
RADIAL, 12.5X25MM
Minimum package
100 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AISHI
Electronic Component
EGW2WM330W25OT
Electronic Component
1
Electronic Component
33uF
Package
12.5x25mm
Electronic Component
Through-hole Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
4.9g
Pitch
5mm
Electronic Component
1
Electronic Component
BM0265728391
Voltage
450V
Capacitor
12.5mm
Capacitor
25mm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EGW2WM330W25OT 直插铝电解电容产品概述

一、产品核心身份与品牌背景

EGW2WM330W25OT是艾华集团(AISHI) 推出的径向直插铝电解电容,定位于中高压电路的滤波、储能与稳压场景。艾华集团作为国内铝电解电容龙头企业,专注电容研发生产30余年,产品覆盖工业控制、汽车电子、消费电子等领域,通过ISO/TS16949、RoHS等认证,可靠性经全球客户验证,是高压电容领域的主流选择之一。

二、关键电气性能参数

该电容的核心电气指标清晰匹配高压电路需求:

  • 容值与精度:33μF(微法),精度±20%——满足多数滤波场景对容值偏差的容忍度,无需额外高精度补偿;
  • 额定电压:450V DC(直流)——针对高压直流电路设计,交流场景需按70%~80%降额使用(如交流峰值电压≤315V);
  • 温度特性:常规工业级范围(-40℃~+105℃),适配户外、高温环境下的稳定工作;
  • 漏电流与损耗:符合铝电解电容行业规范,漏电流低(≤标准值),损耗角正切(tanδ)控制在合理范围,避免能量无效损耗。

三、物理结构与封装规格

封装设计兼顾紧凑性与焊接兼容性:

  • 封装类型:径向引线直插——引脚从电容体两端垂直引出,适配传统插件焊接工艺,无需特殊设备;
  • 尺寸参数:电容体直径(D)12.5mm,长度(L)25mm,引脚间距(P)5mm——体积紧凑,可节省PCB布局空间,焊盘设计需匹配5mm间距避免偏移;
  • 引脚与极性:镀锡铜引脚(抗氧化、焊接牢固),本体带黑色负极环标识,需严格按极性焊接(反向通电会导致击穿泄漏)。

四、典型应用场景

针对450V高压+33μF容值的匹配特性,该电容适用于以下场景:

  1. 工业电源滤波:变频器、伺服驱动器、PLC电源模块的高压滤波,抑制纹波干扰,稳定输出电压;
  2. 家电大功率电路:空调、洗衣机等设备的高压供电单元,实现储能稳压,适配频繁启停工况;
  3. LED驱动电源:高压LED驱动的滤波环节,减少电压波动对LED寿命的影响;
  4. 通信基站辅助电源:户外基站的储能与滤波,适应-40℃~+55℃的环境温度变化;
  5. 小型储能系统:450V以下低压端的滤波或辅助储能,提升系统响应速度。

五、产品优势与可靠性特点

  1. 电压容值匹配精准:450V高压与33μF小容量组合,填补了高压电路中“小容值滤波”的需求空白,避免过大容值导致的体积冗余;
  2. 体积紧凑高效:12.5×25mm封装在高压电容中体积较小,适合高密度PCB设计;
  3. 品牌可靠性保障:采用艾华自研优质铝箔、电解液,经过高低温循环(-40℃+105℃×1000h)、振动(102000Hz×2h)等可靠性测试,寿命远超行业标准;
  4. 环保合规:符合RoHS 2.0、REACH指令,无铅、无镉等有害物质,适配出口产品需求。

六、选型与使用注意事项

  1. 极性绝对严格:必须按本体黑色负极环标识焊接,反向通电10秒内可能击穿,电解液泄漏会腐蚀PCB;
  2. 电压降额使用:交流电路中额定电压需降额至70%(≤315V),脉冲电路需进一步降额(≤50%);
  3. 焊接工艺控制:烙铁头温度≤350℃,焊接时间≤3秒,避免过热损坏电容体;
  4. 存储与维护:常温干燥环境存储(湿度≤60%),未开封存储期≤12个月;长期使用需定期检查漏液、鼓包等异常。

该电容凭借艾华的品牌优势、精准的参数匹配与可靠的性能,成为高压电路滤波/储能场景的高性价比选择,广泛应用于工业、家电等领域。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.