WMSIC Electronic Components

AISHI EMK1JM101GB0D00R

ModelEMK1JM101GB0D00R
PackageSMD,D10xL10.5mm
BrandAISHI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AISHI EMK1JM101GB0D00R
Type
AISHI
Minimum package
550 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AISHI
Electronic Component
EMK1JM101GB0D00R
Electronic Component
1
Electronic Component
100uF
Package
SMD,D10xL10.5mm
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
1.77g
Electronic Component
1
Electronic Component
BM0264937401
Operating Temperature
40℃~+105℃
Voltage
63V
Capacitor
10mm
Capacitor
10.5mm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EMK1JM101GB0D00R 产品概述

一、产品简介

EMK1JM101GB0D00R 为艾华集团(AISHI)系列贴片型铝电解电容器,额定电压63V,标称容量100µF,容差±20%。器件采用SMD封装,电容体直径10mm、长度10.5mm(标注为 D10 x L10.5mm),工作温度范围为 -40℃ 至 +105℃。该器件适用于对体积、耐压与温度性能有较高要求的各类电源与整流滤波场景,是在高电压、高温条件下实现高容值的紧凑型解决方案。

二、主要规格

  • 型号:EMK1JM101GB0D00R
  • 品牌:AISHI(艾华集团)
  • 电容类型:贴片铝电解电容(SMD)
  • 容量:100 µF
  • 容差:±20%
  • 额定电压:63 V DC
  • 工作温度:-40 ℃ ~ +105 ℃
  • 外形尺寸:直径 10 mm × 长度 10.5 mm(D10 x L10.5)
  • 封装形式:SMD(贴片)
  • 极性:有极性(电解电容,请严格注意极性安装)

三、关键特性

  • 高电压能力:63V 额定使其可用于中高压直流回路、前级滤波与能源转换领域。
  • 紧凑体积:在直径仅10mm 的小型化封装中提供100µF容量,便于在空间受限的板级设计中部署较大电容值。
  • 宽温度范围:-40℃ 到 +105℃ 的工作温度覆盖绝大多数工业与汽车电子用例(具体寿命与性能随温度、纹波电流及电压应力变化)。
  • SMD 贴片工艺兼容:适配SMT自动化装配,降低手工焊接的复杂度,提高产线效率。

四、典型应用

  • 开关电源(SMPS)输入输出滤波与能量储存
  • DC-DC 转换器与稳压模块的去耦与输出滤波
  • 工业控制电源与驱动电路的缓冲与抑制纹波
  • 通信设备与基站电源模块(需根据实际环境评估可靠性)
  • 电机驱动与逆变器系统中的中高压滤波场景

五、可靠性与使用建议

  • 极性识别:铝电解电容为有极性元件,必须按标注极性正确焊接,反向电压会导致失效甚至破裂。
  • 电压与温度降额:为延长寿命,建议在额定电压下留有适当降额(典型工程实践为按应用需求降额至额定电压的 70%~80%);高温环境下寿命会显著缩短,应在设计时予以考虑。
  • 纹波电流与散热:电容实际寿命与允许纹波电流、能量耗散密切相关,布局应保证良好散热路径并尽量减小纹波电流集中。
  • 焊接与回流:采用SMT贴装时请遵循厂方回流曲线与工艺指南(通常兼容无铅回流工艺),并注意回流峰值温度与加热时间的限制。
  • 存储与预处理:长期存储后在焊接前可参考厂方建议进行预烘烤以去除水分,避免回流过程中气泡膨胀影响密封。
  • 安全距离与通气:电容顶部通常设有压力释放结构,建议在板上留出足够空间与与其他元件保持安全间距,避免覆盖或阻碍排气。

六、封装与选购信息

  • 封装代码:D10 x L10.5mm,适用于贴片自动化装配与tapereel(卷带)供料(具体包装形式请以供货单为准)。
  • 型号索引:选型时请以完整型号 EMK1JM101GB0D00R 为准,以便获取对应的测试数据、寿命曲线与回流工艺文件。
  • 认证与合规:实际交付器件的合规与认证(如RoHS、AEC-Q 等)请以艾华集团发布的产品资料为准,采购前建议与供应商确认所需的质量与认证文件。

七、工程注意事项(推荐)

  • 在布局阶段预留焊盘与周边散热铜箔,减小电阻路径并改善散热。
  • 对关键滤波回路进行电压降额与温度裕度计算,必要时并联多个电容以分摊纹波电流与降低等效串联电阻(ESR)。
  • 参考厂方 datasheet 完成最终封装尺寸、焊盘图与回流温度曲线设计,以确保良好的可靠性与焊接一致性。

如需更详细的电气参数(如ESR、纹波电流、寿命曲线与回流工艺曲线)与3D封装图或推荐焊盘,请提供需求,我可帮助获取或解析厂方数据表并给出针对性设计建议。

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