Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
AVAGO HCPL-0631-500E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- AVAGO HCPL-0631-500E
- Type
- AVAGO
- Unit
- Electronic Component
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- AVAGO
- Electronic Component
- HCPL-0631-500E
- Electronic Component
- 1
- Package
- SO-8-150mil
- Electronic Component
- Logic Output Optocoupler
- Electronic Component
- 0.179g
- Electronic Component
- 1
- Channel Count
- 1
- CMTI(kV/us)
- 15kV/us
- Electronic Component
- 10Mbps
- Features
- Output; Collector Output
- Electronic Component
- BM69415762
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 4.5V~5.5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HCPL-0631-500E 产品概述
一、概述
HCPL-0631-500E 是由全球知名的电子元器件制造商 Avago Technologies（安华高）生产的一款高性能逻辑输出光耦合器。它采用了 SO-8-150mil 封装，提供了出色的电气性能、耐压能力，并且适用于多种工业和消费类应用。其设计旨在有效实现输入与输出之间的电气隔离，确保信号的完整性，同时提高系统的安全性。
二、主要特性
电源电压范围：HCPL-0631-500E 的工作电源电压范围为 4.5V 至 5.5V DC，使其能够在大多数逻辑电平电路中使用，提供了更大的灵活性。
高速度：该光耦的转速高达 10kV/us，能够迅速地传输高速信号，非常适合高速数据传输的需求。这使其在通信用途、传感器和工业控制系统中非常受欢迎。
耐压能力：HCPL-0631-500E 具有高达 3.75kV 的隔离电压，确保在不同电位之间有良好的电气绝缘能力。这保证了在高电压操作环境下设备的安全性。
优秀的传输特性：通过优化的光传输和接收设计，HCPL-0631-500E 提供了良好的信号传输和高增益特性，确保即使在恶劣环境下也能保持稳定的输出。
封装类型：该器件采用 SO-8-150mil 封装，体积小巧，适合高密度组件应用，并且设计成易于贴装，增强了PCB布局的灵活性。
三、应用领域
HCPL-0631-500E 可广泛应用于以下领域：
工业自动化：在工业自动控制系统中，它可用于传感器接口、控制信号传输和报警系统的隔离，增强系统的可靠性与安全性。
数据通信设备：在高速数据通信系统中，HCPL-0631-500E 可以作为信号隔离和变换，确保数据完整传输，避免信号由于干扰和地电位差而导致的错误。
消费电子产品：在消费电子中，诸如家庭自动化、智能家居设备中，HCPL-0631-500E 可确保电子组件和通信模块之间的有效隔离，提升设备的稳定性。
医疗设备：此光耦的绝缘特性使其在某些医疗设备中得以应用，以隔离高电压部分与低电压控制电路，保护患者及设备安全。
电源管理：在开关电源、UPS 和电源适配器中，HCPL-0631-500E 可用于输出和控制电路之间的有效隔离，同时保证信号的传输。
四、总结
HCPL-0631-500E 是一款多功能、性能优越的逻辑输出光耦合器，凭借其优秀的电源电压范围、高速传输、强大的隔离能力和小巧的封装设计，成为众多工业、消费电子和通信领域的理想选择。无论是在设计初期的信号隔离和保护，还是在成品中的功能实现，HCPL-0631-500E 都能提供可靠的支持，是现代电子设备中不可或缺的元器件之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
