WMSIC Electronic Components

AVAGO 6N137-500E 6N137

Model6N137-500E
PackageSOIC-8
BrandAVAGO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
AVAGO 6N137-500E
Type
AVAGO
Unit
Electronic Component
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
AVAGO
Electronic Component
6N137-500E
Electronic Component
1
Package
SOIC-8
Electronic Component
Logic Output Optocoupler
Electronic Component
0.872g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
10kV/us
Electronic Component
10Mbps
Features
Output; Collector Output
Electronic Component
BM0000285014
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

6N137-500E 产品概述

一、产品简介

6N137-500E是由安华高(Avago)公司生产的一款光耦合器,提供高效的电气隔离功能,适用于各种数字信号传输的应用场景。其逻辑输出特性使其在各种电子设备中发挥重要作用,特别是在数据采集、控制系统及电机驱动等领域。该器件封装采用8-DIP(鸥翼)形式,适合通过插拔方式进行嵌入式系统的设计与应用。

二、主要特性

  1. 电源电压范围: 6N137-500E支持4.5V至5.5V的直流电源,这使其在多种电源应用中具备广泛的兼容性。

  2. 高速度: 该光耦的响应时间高达1kV/us,确保了快速的数据传输能力,对于需要高速信号的应用非常重要。

  3. 良好的隔离性能: 6N137-500E具有高达3.75kV的隔离电压,这意味着其具有优异的抗干扰能力,能够有效保护下游的电路组件不受高电压瞬变的影响。

  4. 逻辑输出特性: 作为逻辑输出光耦,该产品可与TTL和CMOS逻辑电路直接兼容,简化了各种数字电路的设计集成过程。

  5. 封装形式: 采用8-DIP(鸥翼)封装的设计,适合于较大的PCB区域,并且方便焊接与安装,适应广泛的应用需求。

三、典型应用

6N137-500E的独特特性使其适用于多种应用领域,包括但不限于:

  1. 数据采集系统: 在传感器和数据处理组件之间的高电压隔离,能够有效地消除共地干扰,保证信号的准确传送。

  2. 工业控制: 在自动化设备(如PLC,嵌入式控制器)中,提供隔离的开关信号,从而提高系统的稳定性与安全性。

  3. 电机驱动: 在电机驱动器中,光耦合器能够实现对控制信号的有效隔离,保护微控制器免受高电路操作的影响。

  4. 通信设备: 在各种通信设备中,光耦能够实现数字信号的稳定传输,并且具备较好的抗噪声能力。

  5. 家电产品: 隔离和转换控制信号,为家用电器(如洗衣机、空调)提供安全可靠的操作。

四、技术规格

参数说明
工作电压4.5V ~ 5.5V
隔离电压3.75kV
响应时间1kV/us
封装形式8-DIP(鸥翼封装)
输出类型逻辑输出
工作温度范围-40°C ~ +85°C

五、总结

6N137-500E是一款在逻辑输出光耦合器领域表现出色的产品,凭借其高电压隔离性能、快速的响应时间以及广泛的适用电源电压范围,成为工业、通信及消费电子等多个领域的重要组件。随着电子设备对数据传输的要求日益增强,6N137-500E凭借其卓越的性能和可靠性,将为设计工程师提供高效且安全的解决方案。对于需要高频率与高稳定性的现代电子设计,6N137-500E无疑是一款值得考虑的重要器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.