WMSIC Electronic Components

AOTE EL817C

ModelEL817C
PackageDIP-4
BrandAOTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AOTE EL817C
Type
AOTE
Minimum package
100 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AOTE
Electronic Component
EL817C
Electronic Component
1
Package
DIP-4
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.384g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0229305975
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EL817C 光电耦合器(AOTE/奥特)产品概述

一、产品简介

EL817C 是一款单通道光电三极管隔离器件,封装为 DIP-4,适合在要求高共模隔离和低功耗驱动的场合做数字/模拟信号隔离。器件输入为直流 LED 驱动,输出为光电三极管,具有优良的电流传输比(CTR)和较低的集射极饱和电压,适合微处理器接口、开关电源反馈及工业控制等场景。

二、主要参数

  • 隔离电压(Vrms):5 kV
  • 输入类型:DC(LED)
  • 正向压降(Vf):约 1.2 V(If = 标称值)
  • 正向电流 If(最大):50 mA(建议工作点见下)
  • 直流反向耐压 Vr:6 V
  • 电流传输比 CTR:最小 200%,典型/最大可达 400%(饱和值)
  • 输出类型:光电三极管,输出电流可达 50 mA,最大负载电压 80 V
  • 集射极饱和电压 VCE(sat):约 100 mV(条件示例:If = 20 mA,Ic = 1 mA)
  • 上升/下降时间 tr/tf:约 4 μs / 3 μs(低速开关应用)
  • 工作温度:-55 ℃ ~ +110 ℃
  • 封装:DIP-4,品牌:AOTE(奥特)

三、性能与特性

  • 高隔离强度:5 kVrms 满足大多数工业与电源隔离要求。
  • 大 CTR:200%~400%,在较低驱动电流下即可获得较大输出电流,利于降低输入功耗。
  • 低 VCE(sat):在饱和条件下输出电压低(约 0.1 V),适合驱动下级逻辑或小型负载。
  • 中等开关速度:tr/tf 为数微秒,适合数 kHz~数十 kHz 的信号隔离,但不适合高频脉冲或高速数据链路。

四、典型应用

  • MCU/逻辑电平隔离接口(按 CTR 选择驱动电流)
  • 开关电源反馈回路(光耦隔离误差放大器输出)
  • 工业控制信号隔离(PLC、传感器)
  • 继电器/小功率晶体管前级隔离驱动

示例驱动计算:若需得到 Ic = 10 mA(输出),在 CTR 最小 200% 时,所需 LED 电流 If ≈ Ic / CTR = 10 mA / 2 = 5 mA。按照 Vf ≈ 1.2 V 和驱动电压 Vdrive,可计算限流电阻 R = (Vdrive - 1.2 V) / 5 mA。

五、设计建议与注意事项

  • 建议在常规应用中将 If 控制在 1~20 mA 范围,以兼顾寿命与热耗;尽量避免长期在 50 mA 极限值工作。
  • 输出侧需配置合适上拉/限流电阻,注意输出器件的饱和区域与线性区差异。
  • 对于需要更高速或精确模拟传输的场合,考虑专用高速光耦或隔离放大器。
  • 安装与焊接请参考厂商数据手册的推荐工艺与最大热应力参数,保证隔离性能与长期可靠性。

EL817C(AOTE)凭借高隔离、宽温度范围与较高 CTR,在工业与电源领域是性价比较高的光电耦合选择。购买与设计时请以厂商最新数据手册为准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.