WMSIC Electronic Components

AOTE ELM3052

ModelELM3052
PackageSOP-4
BrandAOTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AOTE ELM3052
Type
AOTE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AOTE
Electronic Component
ELM3052
Electronic Component
1
Package
SOP-4
Electronic Component
Thyristor Output Optocoupler
Electronic Component
0.21g
Terminal Block
4
Electronic Component
1
Channel Count
1
Staticdv / dt
1000V/us
Electronic Component
BM0257614113
Operating Temperature
55℃~+110℃
Current
60mA
Surge Current
1A
Type
DC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ELM3052 产品概述

ELM3052 是奥特(AOTE)推出的一款双向可控硅输出光电隔离器件(双向可控硅/双向可控硅式光耦),采用 SOP-4 封装,专为小信号交流开关与隔离控制场合设计。器件在保持低功耗和高隔离电压的同时,提供可靠的交流触发与浪涌抑制能力,适用于通信、工业控制、家电和仪器仪表等对隔离与抗干扰有要求的应用。

一、主要特点

  • 双向可控硅输出(可在交流两方向导通),方便直接对交流负载实现隔离开关或触发大功率可控硅/三端双向器件。
  • 正向压降 Vf ≈ 1.23 V(导通态),导通损耗低,有利于热设计。
  • 输出额定电流 It(rms) = 100 mA,连续正向电流(额定)约 60 mA,适合小功率交流负载或触发下一级功率器件。
  • 隔离电压 Vrms = 3.75 kV,适用于需要高耐压隔离的信号传输场合。
  • 静态 dv/dt 抗扰度 1000 V/μs,能抵抗较高瞬态电压变化,降低误触发风险。
  • 保持电流 Ih = 0.25 mA,低保持电流有利于在较小负载电流下维持导通状态。
  • 工作温度范围宽:-55 ℃ ~ +110 ℃,适应多种工况。
  • 器件耗散功率 Pd = 330 mW,需在电路设计时注意功耗与散热。
  • 封装:SOP-4,端子数 4,便于 PCB 布局与自动贴装。

二、典型应用场景

  • 小功率交流负载的光隔离开关(例如小型交流指示灯、继电器线圈检测等)。
  • 驱动或触发主功率三端双向可控硅(Triac)/可控硅(SCR)的光隔离触发器。
  • 电源存在干扰或需高压隔离的信号传输,如工业控制模块、家用电器控制板、通信设备的线路隔离。
  • 测试与测量设备中对小电流交流开关与隔离需求的电路。

三、设计使用要点

  • 输入端:典型以发光二极管驱动,推荐串联合适限流电阻以控制输入电流到安全工作范围。
  • 输出端:尽管 It(rms) 能到 100 mA,器件耗散功率 Pd 仅 330 mW,应避免长期在额定峰值附近工作;若需驱动更大负载,请使用本器件触发外部功率 Triac。
  • 热管理:在高温或高占空比工作下,注意器件结至环境的热阻与散热,必要时在 PCB 上扩大铜箔散热区域或隔离安装。
  • 抗干扰与夹紧:静态 dv/dt 为 1000 V/μs,可抵抗一般电网瞬态,但在强电磁干扰环境或高 dv/dt 场合,建议配合 RC 抑制或阻尼网络以提高系统可靠性。
  • 低保持电流(Ih = 0.25 mA)利于低电流保持导通,但在设计检测电路时需注意误判与保持条件。

四、封装与安装

ELM3052 采用 SOP-4 小型表面贴装封装,四个引脚便于在紧凑电路板上布置。标准焊接工艺适用,建议在回流焊曲线与焊接温度上遵循器件焊接规范以避免热应力损伤。取放与焊接时注意静电防护与封装机械强度。

五、注意事项与建议

  • 不建议直接用于大功率主电路的长期开关;如需大电流或大功率切换,应做级联设计(用 ELM3052 触发大功率 Triac)。
  • 器件的长期可靠性与热管理密切相关,实际使用应按典型应用图、额定条件与环境温度作适当的电流/功耗降额。
  • 在高振荡或强瞬变环境,建议在输出侧适当增加阻容抑制或采用光耦+RC网络组合以提升抗干扰能力。

总结:ELM3052 是一款面向小信号交流隔离与触发的高隔离度、低功耗双向可控硅器件,适用于需要光隔离与交流开关/触发的多种电子控制场合。在电流与热设计上合理预留裕量,能在工业与民用设备中提供稳定可靠的隔离控制功能。

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