WMSIC Electronic Components

AOTE AT817C-FEL-SE AT817C

ModelAT817C-FEL-SE
PackageSMD-4P
BrandAOTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AOTE AT817C-FEL-SE
Type
AOTE
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AOTE
Electronic Component
AT817C-FEL-SE
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.396g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0221209997
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT817C-FEL-SE 产品概述

一、产品简介

AT817C-FEL-SE 是由 AOTE(奥特)品牌推出的一款高性能电子元器件,属于 SMD(表面贴装器件)系列,采用 SMD-4P 的封装形式。这款元器件广泛用于电子电路中,尤其适合与模拟和数字信号相关的应用场景,如传感器接口、信号放大、开关控制等。

二、技术规格

  • 品牌:AOTE(奥特)
  • 产品型号: AT817C-FEL-SE
  • 封装类型: SMD-4P
  • 引脚数量: 4
  • 工作电压: 通常为 5V 或更高(需根据具体应用来选择合适的电源电压)
  • 工作温度范围: -40°C 至 +85°C,适应不同的环境条件
  • 驱动能力: 可反馈一定的电流能力,通常在数十毫安至几百毫安之间
  • 频率响应: 适合中低频应用,具体参数需参考数据手册

三、功能特点

  1. 高集成度: AT817C-FEL-SE 采用了先进的集成电路设计,具备较小的体积和较高的集成度,使得它在设计上可以节省更多的空间和材料。

  2. 保障稳定性: 在多种工作条件下,AT817C-FEL-SE 表现出良好的耐压和抗干扰能力,确保了在实际应用中的信号稳定性和可靠性。

  3. 易于焊接: SMD-4P 封装使得该元器件可以通过自动化生产线进行高效焊接,提高了生产效率,降低了人工成本。

  4. 适用广泛: 该元器件适用于多种场景,如消费电子、工业控制系统、网络设备等。

四、应用领域

  • 消费电子: 可用于电视、音响等设备的音频信号处理和控制。
  • 工业自动化: 在PLC(可编程逻辑控制器)和传感器等设备中,作为信号转换或开关件使用。
  • 智能家居: 被广泛应用于智能灯光控制、家庭自动化系统等领域。
  • 汽车电子: 在汽车的控制系统中,用于信号的放大和处理。

五、使用注意事项

  1. 电源管理: 确保供电电压在规定范围内,以免造成元件损坏。
  2. 布局设计: 前期设计时应根据其封装特点进行合理布局,确保热量的有效散发与信号的高效传输。
  3. 焊接技术: 在进行SMD元件的焊接时,需选择合适的焊接温度和时间,以免影响元件性能。

六、总结

AT817C-FEL-SE 是一款性能优越、功能强大的电子元器件,凭借其小巧的 SMD-4P 封装,广泛适用于各种电子应用中。无论是在消费电子产品还是在工业设备中,它都提供了稳定的性能和良好的可靠性,是设计人员非常推荐的选择。未来,随着电子技术的不断发展,AT817C-FEL-SE 将继续在更多的领域展现出其卓越的潜力。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.