WMSIC Electronic Components

AOTE EL817DS

ModelEL817DS
PackageSMD-4P
BrandAOTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AOTE EL817DS
Type
AOTE
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AOTE
Electronic Component
EL817DS
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.413g
Electronic Component
1
Electronic Component
18us
Electronic Component
BM0257614116
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EL817DS(AOTE 奥特)产品概述

EL817DS 是一款单通道光电三极管输出的光耦合器,封装为 SMD-4P,适用于需要电气隔离的低速信号传输和控制场合。该器件以高隔离电压、宽工作温度和可观的电流传输比(CTR)著称,兼顾了抗干扰能力与成本效率,适合工业控制、电源反馈与微控制器接口等应用。

一、主要特性

  • 输入类型:直流(LED 驱动)
  • 输出类型:光电三极管
  • 正向压降 (Vf):典型 1.2 V
  • 正向电流 (If):最大 50 mA(建议按应用要求针对性取值)
  • 输出电流 / 集电极电流:最大 50 mA
  • 电流传输比 (CTR):最小 80%,最大 / 饱和值可达 600%
  • 隔离电压 (Vrms):5 kV,适合工业级信号隔离
  • 直流反向耐压 (Vr):6 V(LED 端反向耐压)
  • 允许集电极-发射极电压(负载电压):最大 80 V
  • 集-射饱和电压 VCE(sat):约 100 mV(测试条件 If=20 mA,Ic=1 mA)
  • 上升/下降时间(tr / tf):约 18 μs / 18 μs(总切换时间决定了响应带宽)
  • 工作温度范围:-55 ℃ ~ +110 ℃
  • 封装:SMD-4P(表面贴装)
  • 品牌:AOTE(奥特)

二、性能说明与电气含义

  • CTR(电流传输比):表示输出集电极电流与输入 LED 正向电流之比。EL817DS 的 CTR 下限为 80%,在某些条件下可高达 600%。这意味着在不同 If 下输出 Ic 变化大,设计时应考虑最差(最小 CTR)条件以保证可靠性。
  • 隔离能力:5 kVrms 的隔离电压表明器件能够提供可靠的信号隔离,降低高压侧对低压侧的干扰和危险。适用于需要防止地环路或高压穿越的场合。
  • 开关速度:18 μs 的上升/下降时间决定了该器件适合低中速信号(典型带宽约几十 kHz 级),不适宜高频高速光隔离(例如 1 MHz 以上)场合。
  • VCE(sat) 特性:约 100 mV 的饱和压降在驱动低电平负载或作开关时有利于降低功耗和热量。

三、典型应用

  • 工业控制信号隔离(PLC、模块化控制器接口)
  • 电源和开关电源反馈回路(隔离反馈、参考检测)
  • 微控制器与高电压侧器件间的逻辑隔离
  • 继电器和小功率开关前的驱动隔离
  • 家电、电梯与照明控制等要求电气隔离的系统

四、封装与机械特性

EL817DS 使用 SMD-4P 表面贴装封装,便于在自动化 SMT 生产线中进行高密度贴装与回流焊流程。SMD 封装有利于体积小、可靠性高及散热管理,但焊接与回流温度曲线应遵循制造商推荐以避免封装应力与性能退化。

五、设计建议与使用要点

  • LED 驱动:计算限流电阻 R = (Vcc - Vf) / If。示例:若 Vcc=5V、目标 If=10 mA,则 R ≈ (5 - 1.2)/0.01 ≈ 380 Ω(取标准阻值)。避免长期在最大 If (50 mA) 下工作,建议按寿命与发热要求进行余量设计。
  • 输出拉升:光电三极管通常作为开集电极使用,需要外部上拉电阻到目标电源。上拉电压不得超过器件的最大负载电压 80 V。
  • 考虑 CTR 漂移:CTR 随温度与 If 变化显著,建议在设计中按最小 CTR 80% 进行最坏情况计算,保证在低灵敏度情况下仍满足输出电流需求。
  • 速度与去耦:若需要更快响应,可在电路中通过减小负载电容或选择更低阻值的上拉电阻略微改善,但总体开关速度受限于器件本身物理特性。
  • 反向保护:LED 的反向耐压仅 6 V,电路中如有反向冲击需加二极管或限压措施保护 LED。

六、可靠性与注意事项

  • 环境耐受:工作温度范围宽,适合恶劣环境,但在高温高湿环境下需注意长期可靠性与隔离材料老化。
  • 焊接工艺:SMD 封装需按推荐回流温度曲线焊接,避免过高峰值温度或过长保温时间。
  • ESD 与浪涌:虽然该器件具备良好隔离性能,但输入 LED 与输出端仍需在系统级加入浪涌与静电保护措施。

结语 EL817DS(AOTE 奥特)以其高隔离电压、较宽的 CTR 范围和可靠的温度性能,适合多数需要电气隔离的控制与信号传输场合。在选型和电路设计时应以最小 CTR、额定电压与热管理为基准,合理配置驱动电流与上拉电阻,以确保稳定可靠的长期运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.