WMSIC Electronic Components

AOTE 6N136S

Model6N136S
PackageSMD-8P
BrandAOTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AOTE 6N136S
Type
AOTE
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AOTE
Electronic Component
6N136S
Electronic Component
1
Package
SMD-8P
Electronic Component
Logic Output Optocoupler
Electronic Component
0.888g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
1kV/us
Electronic Component
1Mbit/s
Electronic Component
BM0257614106
Operating Temperature
40℃~+100℃
Operating Voltage
4.5V~18V
Type
DC
Output Voltage
20V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

6N136S 光耦(逻辑输出)产品概述

一、产品简介

6N136S(AOTE/奥特,SOP-8封装)是一款高速逻辑输出型光耦,输入为直流驱动,适用于数字信号隔离场合。该器件在工作电压4.5V~18V范围内可稳定工作,通道数为单通道,传输速率达1Mbit/s,隔离耐压(Vrms)5kV,工作温度范围-40℃~+100℃,适合工业级应用。

二、主要电气参数

  • 输入:LED正向压降 Vf ≈ 1.45V,最大正向电流 If 25mA;直流反向耐压 Vr 5V。
  • 输出:逻辑输出,最大输出电流约8mA,输出电压可承受至20V(器件绝对最大额定)。
  • 传输性能:典型传输速率1Mbit/s;高低电平传播延迟 tpLH、tpHL 均约800ns。
  • 光电隔离:隔离电压5kV(Vrms);共模暂态抗扰度 CMTI 1kV/µs。
  • 其他:电流传输比(CTR)约19%(在特定If与Vce条件下测得)。

三、功能特点(要点)

  • 单通道高速逻辑输出,适合TTL/CMOS接口电平隔离。
  • 高隔离电压(5kVrms),提供可靠的安全隔离与信号保护。
  • 宽工作电压范围(4.5V~18V),便于与不同逻辑电源配合。
  • 紧凑SOP-8表面贴装封装,利于SMT工艺与密集布板。
  • 输出驱动能力有限(8mA),适合驱动逻辑输入或作为中间隔离级。

四、典型应用场景

  • MCU 与高压/噪声侧的数字隔离(UART、SPI 等低速接口)。
  • 工业控制信号隔离、PLC 输入/输出保护。
  • 电源管理与测控系统的逻辑隔离。
  • 需要高隔离等级但频率要求不极高的场合。

五、设计与使用建议

  • 输入限流:按示例计算,若以5V逻辑驱动并要求输入电流20mA,可选限流电阻 R ≈ (5V − 1.45V)/20mA ≈ 180Ω。注意不要超过If最大25mA。
  • 输出上拉:由于输出为开集电极/逻辑输出,需外接上拉电阻以匹配目标逻辑电平;若驱动更大负载,应加缓冲器。
  • 抗干扰:器件CMTI为1kV/µs,面对强共模瞬变场合需加强布局(增大输入/输出间距、加共模滤波、地线隔离)或选用更高CMTI器件。
  • 温度与功耗:长期在高温或高If下工作会降低CTR并影响寿命,建议在最高工作温度下适度降额使用。
  • PCB 安全间距:为满足5kVrms隔离,应在PCB上保持足够的爬电距离与空隙,必要时配合灌封或隔离槽。

六、封装与引脚

  • 封装:SMD-8P(SOP-8)。引脚定义与典型6N136系列兼容,布局便于标准贴片生产与回流焊工艺。

七、可靠性与注意事项

  • 在高压隔离系统中,应避免在未按规范固化的PCB上直接测高压(防止损坏隔离结构)。
  • CTR 与传输速率受温度、If、Vcc 等影响,实际设计时请参照器件曲线并留有余量。
  • 输出驱动能力有限,如需驱动继电器或大电流负载,请外接驱动器或放大级。

以上为6N136S(AOTE)光耦的概述及实用设计注意点。若需更详细的电气曲线、典型时序图或参考电路图,可提供具体应用场景以便给出针对性的电路建议。

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