WMSIC Electronic Components

AOTE MOC3083SM

ModelMOC3083SM
PackageSMD-6
BrandAOTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AOTE MOC3083SM
Type
AOTE
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AOTE
Electronic Component
MOC3083SM
Electronic Component
1
Package
SMD-6
Electronic Component
Thyristor Output Optocoupler
Electronic Component
0.741g
Terminal Block
6
Electronic Component
1
Channel Count
1
Staticdv / dt
600V/us
Electronic Component
BM0257614105
Operating Temperature
55℃~+110℃
Current
60mA
Surge Current
1A
Load Voltage
800V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOC3083SM 可控硅输出光耦 — 产品概述

一、产品简介

MOC3083SM 是一款带过零功能的双向可控硅输出光电耦合器,由 AOTE(奥特)生产,采用 SMD-6(SOP-6,2.54mm)封装。器件将发光二极管与可控硅触发单元在光学上隔离,实现输入侧与大功率交流侧的安全驱动与隔离控制,适用于交流负载的开关控制与相位无关的零交叉触发场合。

二、主要参数概览

  • 可控硅类型:双向可控硅(Triac driver)
  • 过零功能:有(zero-cross)
  • 正向压降(Vf):1.2 V(LED)
  • 输出电流(It(rms)):100 mA
  • 正向电流(If):60 mA(最大)
  • 负载电压(Vdrm/peak):800 V
  • 静态 dv/dt:600 V/μs
  • 隔离电压(Vrms):5 kV
  • 保持电流(Ih):0.28 mA
  • 浪涌电流:1 A
  • 通道数:1 路
  • 工作温度范围:-55 ℃ ~ +110 ℃
  • 耗散功率(Pd):330 mW
  • 引脚数:6 针

三、特性与优势

  • 过零触发功能可在交流电压接近零点时导通,显著降低触发噪声与电磁干扰(EMI),适合大量并联负载的交流开关应用。
  • 高隔离电压(5 kV)提供良好的输入-输出安全隔离,适用于需要安全隔离的工业与家电场合。
  • 输出耐受高达 800 V 的负载电压和 600 V/μs 的 dv/dt 能力,增强在交流系统中的抗干扰可靠性。
  • 小型 SMD-6 封装便于自动贴装与节省电路板空间,适合量产和空间受限的设计。

四、典型应用场景

  • 家用电器交流加热器、灯光、风扇等的无触点控制;
  • 工业控制中的交流负载开关、固态继电器(SSR)驱动单元;
  • 需要隔离控制信号与高压交流侧的各种电路,例如电源管理与自动化设备。

五、使用与设计要点

  • 由于器件为过零触发型,若需相位控制(可控触发角),应选择非过零型或采用其他相位控制方案。
  • LED 正向压降约 1.2 V,驱动电阻与输入电流应按 If(60 mA)及实际触发门槛设计,确保可靠触发同时保护 LED。
  • 注意保持电流 Ih(0.28 mA)与浪涌限制(1 A),在负载瞬态或高噪声环境下应加合适抑制元件(RC 或 snubber)。
  • 考虑封装耗散功率 Pd(330 mW)与工作温度,合理安排 PCB 散热与器件布局。

六、封装与可靠性

MOC3083SM 为 SOP-6(SMD-6)表面贴装封装,适应工业级-55 ℃ 至 +110 ℃ 的工作温度范围。建议在 PCB 布局时保持输入与输出区域隔离并遵循耐压爬电距离要求,以发挥器件的隔离能力及长期可靠性。

七、注意事项

  • 选型时确认过零功能是否符合系统需求;
  • 在高 dv/dt 或高浪涌条件下,应评估外部抑制与保护电路;
  • 引脚焊接与回流工艺应按照 SMD 封装规范进行,避免过热影响性能。

综上,MOC3083SM 是一款适用于交流负载隔离驱动、具过零触发和高隔离特性的单路双向可控硅光耦,适合家电、工业控制与固态继电器等场合使用。

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