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AOTE MOC3023M
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- AOTE MOC3023M
- Type
- AOTE
- Minimum package
- 50 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- AOTE
- Electronic Component
- MOC3023M
- Electronic Component
- 1
- Package
- DIP-6
- Electronic Component
- Thyristor Output Optocoupler
- Electronic Component
- 0.38g
- Terminal Block
- 6
- Electronic Component
- 1
- Channel Count
- 1
- Staticdv / dt
- 100V/us
- Electronic Component
- BM0257614103
- Operating Temperature
- 55℃~+110℃
- Current
- 60mA
- Load Voltage
- 400V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MOC3023M 可控硅输出光耦 产品概述
一、产品简介
MOC3023M 是一款双向可控硅输出的光电隔离器（Optocoupler），用于在低电压控制侧与高电压交流侧之间实现电气隔离并驱动可控硅/三端双向触发器。该器件为非过零（non-zero cross）型，适合需要在任意相位触发负载的应用。AOTE（奥特）品牌，DIP-6 封装，易于插装和开发板使用。
二、主要性能参数
- 光耦类型：双向可控硅输出（非过零）
- 输入 LED 正向压降 Vf：1.18V（典型）
- LED 最大正向电流：60mA（建议工作电流远低于极限）
- 输出可控硅 RMS 电流 It(rms)：100mA（驱动级）
- 负载耐压：400V（最大输出耐压）
- 隔离电压 Vrms：5kV（输入—输出间隔离）
- 静态 dv/dt：100V/µs（关断状态抗扰能力）
- 保持电流 Ih：0.25mA（输出导通保持）
- 功耗 Pd：330mW（器件最大耗散）
- 工作温度范围：-55℃ ~ +110℃
- 封装：DIP-6，端子数 6
三、典型应用场景
- 家电交流负载控制（如灯光调光、马达软启动）
- 工业交流继电与小功率交流开关的隔离驱动
- 需按任意相位触发的相位控制电路（非过零触发场合）
- 隔离的门极驱动、保护电路或信号耦合场合
四、封装与常见引脚定义
常见 DIP-6 引脚定义（以典型封装为例）：
- Pin1：Anode（LED 阳极）
- Pin2：Cathode（LED 阴极）
- Pin3：NC（空脚）
- Pin4：MT2（可控硅端子2）
- Pin5：MT1（可控硅端子1）
- Pin6：NC（空脚）
使用时请以实际采购数据手册为准，并注意引脚方向与 PCB 布局一致。
五、使用建议与注意事项
- 驱动 LED 时推荐工作电流 5–20mA，以保证可靠触发同时延长寿命；根据控制电压计算限流电阻：R = (Vctrl − Vf) / If。例如 5V 驱动、If=20mA，R≈(5−1.18)/0.02≈190Ω。
- 输出侧仅为触发级，It(rms)=100mA 不适合直接做大功率负载开关，应用于驱动主功率三极管或主可控硅的门极。
- 在高 dv/dt 或干扰环境下，考虑在负载侧加入 RC 闪光抑制网络（snubber）或并联小电阻，以防误触发。
- 保持器件在 Pd 和温度范围内工作，合理安排散热与 PCB 走线，确保隔离距离与爬电距离满足安全规范。
- 产品为非过零触发，适合需要角度控制和精确触发时使用，但在交流电网有大量 EMI 时需加强滤波与抑制。
六、结语
MOC3023M 以其较高的隔离电压、方便的 DIP-6 封装和双向可控硅输出，适合中低功率交流控制与隔离驱动场合。选型与设计时请参考完整数据手册，按照器件极限参数留有裕量，并结合实际负载与电磁兼容要求进行电路保护设计。
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