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ARTERY AT32F421K8U7
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ARTERY AT32F421K8U7
- Type
- ARTERY
- Minimum package
- 4900 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ARTERY
- Electronic Component
- AT32F421K8U7
- Electronic Component
- 1
- Package
- QFN-32(5x5)
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 2.09g
- CPU
- 32 Bit
- CPU
- ARM Cortex-M4
- I / O
- 27
- RAM
- 16KB
- Electronic Component
- 1
- Features
- Gate (WWDG); Gate (IWDG); (BOR / LVD / LVR / LVI);; positions(POR); Built-in General Purpose; Built-in Temperature Sensor; CRC;; Integrated LDO
- Electronic Component
- BM0229919225
- Operating Temperature
- 40℃~+105℃
- Operating Voltage
- 2.4V~3.6V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AT32F421K8U7 产品概述
一、核心与性能
AT32F421K8U7 基于 ARM Cortex‑M4 32 bit 内核，最高主频可达 120MHz，适合对实时性和计算性能有较高要求的嵌入式控制应用。Cortex‑M4 平台对控制算法和数字信号处理（DSP）类运算有良好支持，可在有限资源下实现较高的运算效率与响应速度。
二、存储与 I/O 能力
芯片内置 64KB FLASH 程序存储器与 16KB SRAM，为中等复杂度固件和数据缓冲提供充足空间。片上可用 I/O 数量为 27 路，适合连接多路传感器、外设和控制接口，在 QFN‑32 (5x5) 封装条件下兼顾功能与面积占用。
三、电气特性与可靠性
工作电压范围为 2.4V ～ 3.6V，适配常见锂电与 3.3V 系统电源。工作温度范围为 ‑40℃ 到 +105℃，满足工业级与户外等严苛环境的温度要求。振荡器支持内置与外置晶振，方便在功耗与频率精度之间进行权衡。
四、封装与布局建议
封装为 QFN‑32(5x5)，适合紧凑型电路板设计。建议在 PCB 布局时重视电源去耦（在 VDD 附近放置 0.1µF 与 1µF 电容）、地平面完整性以及晶振走线微带/差分处理，合理安排裸露散热焊盘以改善热性能与可靠性。
五、片上外设与生态支持
AT32F421K8U7 提供丰富片上外设以支持多种嵌入式应用需求（常见包括串口、SPI、I2C、定时器/PWM、模数转换等接口），并兼容 ARM 生态（CMSIS），可使用主流工具链（Keil、IAR、GCC）进行开发与调试。调试接口通常通过 SWD 等标准方式，便于固件下载与在线调试。
六、典型应用场景
适用于工业控制与自动化、智能传感器与数据采集、消费电子与家用电器、便携式与低功耗设备、楼宇/安防控制、简单电机驱动与 PWM 调速等多个场景。其工业温度等级和较宽电压范围使其在工业与户外应用中更具优势。
七、设计注意事项
- 电源设计：保证上电顺序稳定，采用充足的去耦与滤波；在电源变化剧烈场合注意复位与 brown‑out 设置。
- 时钟选择：对时钟精度要求高的通讯或采样场景建议使用高精度外部晶振。
- I/O 限流与保护：对高电压或长线驱动的 I/O 加入限流与 TVS 防护以提高系统鲁棒性。
- 固件设计：利用 Cortex‑M4 的中断与 DMA 能力优化实时性能与功耗。
总结：AT32F421K8U7 在 32 位高主频、适中存储与丰富 I/O 的组合下，为尺寸受限但需较强控制与通讯能力的嵌入式产品提供了性价比高且可靠的解决方案。
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