WMSIC Electronic Components

ARTERY AT32F423KBU7-4 AT32F423KBU7

ModelAT32F423KBU7-4
PackageQFN32_4X4
BrandARTERY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ARTERY AT32F423KBU7-4
Type
ARTERY
Minimum package
4900 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ARTERY
Electronic Component
AT32F423KBU7-4
Electronic Component
1
Package
QFN32_4X4
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1g
CPU
ARM Cortex-M4F
I / O
27
RAM
48KB
Electronic Component
1
Features
Gate (WWDG); Gate (IWDG); (BOR / LVD / LVR / LVI);; positions(POR); Built-in General Purpose; Built-in Temperature Sensor; CRC;; Integrated LDO
Electronic Component
BM0264971465
Operating Temperature
40℃~+105℃
CPU
150MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT32F423KBU7-4 产品概述

一、概述

AT32F423KBU7-4 是 ARTERY(雅特力)面向中高端嵌入式应用的 32 位微控制器,基于 ARM Cortex‑M4F 内核,内置浮点单元(FPU)和 DSP 指令集,适合需要实时运算和信号处理的控制类产品。芯片集成多种电源与安全特性,并提供执行保护与启动加载器支持,适用于工业控制、智能家电、遥控与通信终端等场景。

二、核心性能

  • CPU:ARM Cortex‑M4F,带 FPU,支持 DSP 指令集、单周期乘法及硬件除法,最高主频 150 MHz。
  • 存储:程序 Flash 128 KB(产品型号标定),内部 Bootloader 区约 20 KB(可一次性配置为用户区)。
  • SRAM:48 KB,具备存储保护单元(MPU),支持代码/数据访问权限控制与执行保护。

三、存储与安全机制

  • sLib 安全库支持:可将指定主存储区设为执行代码的安全库区,该区代码可以执行但不可被直接读取,有利于保护固件与算法知识产权。
  • 硬件 CRC:加速校验与数据完整性验证。
  • 上电复位(POR)与欠压检测(BOR/LVD/LVR/LVI):保证在电源异常或低压条件下系统可靠复位,提升系统稳定性。

四、电源、温度与可靠性

  • 集成 LDO 稳压器,简化电源管理设计。
  • 工作温度范围:-40℃ 至 +105℃,满足工业级温度要求。
  • 看门狗:窗口看门狗(WWDG)与独立看门狗(IWDG),用于提升系统在异常情况下的自恢复能力。
  • 内置温度传感器,便于实现温度监控与保护策略。

五、外设与特色功能

  • I/O 数量:27 个,可满足多数控制与接口需求。
  • 定时器:内置通用定时器,支持事件计时与 PWM 等功能(具体定时器通道视具体外设文档)。
  • 红外遥控支持:集成红外遥控功能,适合遥控设备与人机交互场景。
  • 硬件乘法/除法与 FPU 提供快速浮点运算能力,适合复杂控制算法和数字信号处理。

六、封装与适用场景

  • 封装形式:QFN32,4×4 mm,适合空间受限的板级设计。
  • 典型应用:工业控制器、智能家电、红外遥控终端、消费类电子、通信接口模块、需要实时运算与安全保护的嵌入式设备。

七、开发建议

  • 结合 Cortex‑M4F 的 FPU 与 DSP 指令优化关键算子(滤波、控制律、傅里叶变换等),可显著提升性能与效率。
  • 合理使用 MPU 与 sLib 执行保护区,保护算法与关键数据不被读取或篡改。
  • 启用硬件 CRC 与看门狗机制,提升产品在实际部署中的可靠性与容错能力。

AT32F423KBU7-4 在性能、可靠性与安全性之间取得平衡,适合对计算能力与系统稳定性有较高要求的中小型嵌入式项目。具体外设电气特性和时序请参考官方数据手册与参考设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.