WMSIC Electronic Components

Brightking UAD03C05L01

ModelUAD03C05L01
PackageDFN1608-2
BrandBrightking
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Brightking UAD03C05L01
Type
BRIGHTKING
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Brightking
Electronic Component
UAD03C05L01
Electronic Component
1
Package
DFN1608-2
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.021g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.5pF
Electronic Component
BM0265797520
Operating Temperature
55℃~+150℃
Voltage
14V
Electronic Component
IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Brightking UAD03C05L01 ESD防护二极管产品概述

一、产品定位与核心优势

台湾君耀(Brightking)推出的UAD03C05L01是一款针对敏感电子设备设计的高性能ESD(静电放电)防护二极管,聚焦高速信号线路的静电防护需求,兼具小体积、低电容、宽温适配等核心特点,是消费电子、汽车电子、工业控制等领域的高性价比防护方案。

其核心优势可归纳为三点:

  1. 信号完整性优先:0.5pF超低结电容,兼容USB 3.0、HDMI 2.0等高速信号传输,避免信号失真;
  2. 双向全防护:双向极性设计,可同时抑制正、负静电脉冲,防护无死角;
  3. 严苛环境适配:-55℃~+150℃宽温范围,满足汽车电子、工业现场等极端温度场景需求。

二、关键参数全面解析

UAD03C05L01的参数设计精准匹配静电防护与电路兼容性,核心参数如下:

1. 防护性能参数

  • 反向截止电压(Vrwm):5V:正常工作时反向偏置电压上限,确保电路在5V以内工作时二极管不导通,不干扰原电路功能;
  • 击穿电压(Vbr):6V:反向偏置导通起始电压(典型值),介于工作电压与钳位电压之间,平衡防护灵敏度与功耗;
  • 钳位电压(Vc):14V:峰值脉冲电流3A(8/20μs标准脉冲)下的电压,可将静电脉冲钳位在后端电路可承受范围内,避免器件损坏;
  • 峰值脉冲电流(Ipp):3A@8/20μs:符合IEC 61000-4-2静电防护标准的最大脉冲承受能力,可应对日常人体静电(2kV HBM)与设备级冲击;
  • 防护等级:IEC 61000-4-2:通过国际静电防护认证,可靠性有保障。

2. 电气特性参数

  • 结电容(Cj):0.5pF:高速信号防护核心指标,低电容减少信号反射与衰减,适配10Gbps以下高速接口;
  • 反向漏电流(Ir):500nA:反向偏置漏电流极低,不增加电路静态功耗,适合低功耗设备;
  • 通道数:单路:单通道防护设计,适合单根信号线的独立防护。

3. 环境与可靠性参数

  • 工作温度:-55℃~+150℃:覆盖汽车级(-40℃~125℃)与工业级要求,适应高温存储、低温启动场景;
  • 封装:DFN1608:1.6mm×0.8mm小尺寸封装,无引脚设计减少寄生电感,提升高频性能。

三、封装与工艺特点

UAD03C05L01采用DFN1608无引脚扁平封装,具备三大工艺优势:

  1. 小体积高密度:尺寸仅1.6mm×0.8mm×0.5mm,比传统SOT-23封装小60%,适配智能手机、智能穿戴等小型化设备;
  2. 低寄生参数:无引脚设计消除引脚寄生电感,进一步提升高频信号完整性;
  3. 散热性能优:封装底部直接与PCB铜箔接触,快速耗散ESD脉冲能量,延长器件寿命。

四、典型应用场景

基于参数与封装优势,UAD03C05L01广泛应用于:

  1. 高速数字接口:USB 2.0/3.0、HDMI 1.4/2.0、LVDS、MIPI等接口防护;
  2. 消费电子:智能手机(充电口/数据口)、平板电脑(Type-C接口)、笔记本电脑(HDMI/USB接口);
  3. 汽车电子:车载显示屏(MIPI接口)、车载摄像头(LVDS接口)、CAN/LIN通信接口;
  4. 工业控制:PLC输入输出接口、传感器模块(RS485接口)、工业通信网关;
  5. 通信设备:路由器(以太网接口)、无线AP(WiFi模块接口)、基站射频接口。

五、选型与应用注意事项

  1. 电压匹配:后端电路工作电压需≤Vrwm(5V),若为12V电路需更换更高Vrwm型号(如UAD03C12L01);
  2. 布局优化:防护器件尽量靠近接口(如USB口),引线长度≤5mm,避免寄生电感降低防护效果;
  3. 并联扩容:需更高防护电流(>3A)时,可并联2~3个,但需注意结电容叠加(n个则为n×0.5pF);
  4. 温度考量:长期工作温度建议≤125℃,避免150℃以上高温,确保可靠性。

该产品凭借平衡的防护性能与信号兼容性,成为中小体积高速设备静电防护的主流选择,适配多领域严苛应用需求。

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