WMSIC Electronic Components

Brightking SMD2016B050TF

ModelSMD2016B050TF
Package2016
BrandBrightking
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Brightking SMD2016B050TF
Type
BRIGHTKING
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Brightking
Electronic Component
SMD2016B050TF
Electronic Component
1
Package
2016
Electronic Component
Resettable Fuse
Electronic Component
0.13g
Electronic Component
1
Electronic Component
5s
Electronic Component
BM0259314156
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
60V
Power(Pd)
1.4W
Current(Imax)
20A
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD2016B050TF 产品概述

一、产品简介

SMD2016B050TF 是 Brightking(台湾君耀)推出的一款表面贴装自恢复保险丝(Polymeric PTC Resettable Fuse),封装规格为 2016(约 2.0 × 1.6 mm)。本型号额定保持电流为 500 mA,适用于对短路及过流保护有自动复位需求的小型电子设备与模块。典型应用包括便携式电源、通信设备、消费电子和外设接口保护等。

二、主要电气参数

  • 耐压(Vmax):60 V
  • 最大电流(Imax):20 A
  • 保持电流(Ihold):0.55 A(550 mA)
  • 跳闸电流(Itrip):1.1 A
  • 消耗功率(Pd):1.4 W
  • 初始态电阻(Rmin):200 mΩ
  • 跳断后电阻(R1max):1 Ω
  • 动作时间:约 5 s(在标准过流条件下)
  • 工作温度范围:-40 ℃ ~ +85 ℃

以上参数为器件在标准测试条件下的典型或上限值,具体应用时应参考实际电路与热环境。

三、物理与封装信息

SMD2016B050TF 采用 2016 SMD 封装,适合高速贴片生产与回流焊工艺。型号名称中的 “050” 表示 500 mA 等级,“TF” 多用于厂方封装/包装标识(如盘带包装)。小型化封装有助于节省 PCB 面积并实现近源点的电路保护布局。

四、特性与优势

  • 自恢复功能:在过流消除后能自动恢复导通,无需更换元件,便于维护。
  • 低初始电阻:200 mΩ 起始阻值,减少正常工作时的压降与功耗。
  • 可承受高冲击电流:Imax 达 20 A,能承受瞬态冲击电流而不致永久性损坏。
  • 宽温工作范围:-40 ℃ 到 +85 ℃,适应多种环境条件。
  • 小体积、易贴装:适合空间受限的便携或板载应用。

五、典型应用场景

  • USB/外设接口过流保护(如充电口、外围设备接口)
  • 手机配件与小型电源管理模块
  • 通信设备与路由器的电源输入保护
  • 工业控制中低压电源保护与模块防护

六、使用与焊接建议

  • 布局时建议将自恢复保险丝靠近被保护电路的电源输入端,缩短导线长度以减小寄生阻抗。
  • 避免将器件置于持续高温区域;长时间在额定极限接近的电流下工作会缩短使用寿命。
  • 回流焊时应遵循 PCB 与焊膏供应商的推荐波峰/回流温度曲线,避免反复高温暴露。
  • 在设计中应考虑热散失与周边发热元件的影响,必要时留有散热空间或采用热铜箔加大散热面积。

七、选型与注意事项

  • 若电路存在频繁的短路或高能脉冲,需评估器件的自恢复次数与长期可靠性,或考虑并联/并用其它保护手段。
  • 设计工作电流时建议在保持电流以下留有裕量,避免长期在 Ihold 附近运行以提高稳定性。
  • 对于对延时敏感或需要快速断开的场合,应注意本类元件的动作时间(约 5 s)与系统保护策略的配合。

SMD2016B050TF 以其小型化、自动复位与较强的冲击承受能力,适合在多种低压电源保护场合使用。选型时请结合实际工作电流、热环境和动作时间要求,必要时联系供应商获取详细数据表与可靠性测试报告。

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