WMSIC Electronic Components

Brightking SMD1206B050TF/24 SMD1206B050TF

ModelSMD1206B050TF/24
Package1206
BrandBrightking
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Brightking SMD1206B050TF / 24
Type
BRIGHTKING
Minimum package
3000 圆盘

Technical parameters

Power
600mW
Electronic Component
Electronic Component
Electronic Component
Brightking
Electronic Component
SMD1206B050TF/24
Electronic Component
1
Electronic Component
1.8mm
Package
1206
Electronic Component
PTCThermistor Resistor
Electronic Component
0.032g
Electronic Component
3.4mm
Electronic Component
750mΩ
Electronic Component
1.2mm
Electronic Component
1
Electronic Component
BM0228052334
Operating Temperature
40℃~+85℃
Operating Voltage
24V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1206B050TF/24 产品概述

一、产品简介

SMD1206B050TF/24 为台湾君耀(Brightking)出品的一款1206封装贴片电阻,属于常用的片式电阻系列。该产品适用于24V工作环境,额定功率600mW,工作温度范围为-40℃至+85℃,适配常见的SMT生产工艺与回流焊流程,兼顾体积与功率承载能力,适合于工业级与消费类电子设备中通用电阻场合。

二、主要参数与性能特点

  • 封装:1206(常见外形尺寸,便于自动贴装与检测)。
  • 工作电压:24V(适用于中低压电路保护与分压场景)。
  • 额定功率:600mW(在规定的环境温度范围内稳定工作)。
  • 温度范围:-40℃ ~ +85℃,满足工业级温区需求。
  • 品牌:Brightking(台湾君耀),质量与供货稳定性良好。
  • 封装与表面处理兼容常见焊接工艺,抗热冲击性适配回流曲线。

三、典型应用场景

  • 电源滤波与分压电路:适合24V体系中的电压分配与限流应用。
  • 信号处理与偏置网络:在模拟和数字混合电路中作为阻值元件使用。
  • 工业控制与仪表:适应宽温环境,对可靠性有一定要求的终端产品。
  • 汽车电子(非高温区)与通信设备:满足常温及低温启动等工况。

四、设计与安装建议

  • 熔断与功率热管理:建议在PCB布局中为该电阻预留适当的散热铜箔,避免与高发热元件并列密集放置;必要时考虑加大散热区或改用更大功率元器件。
  • 焊接工艺:推荐采用标准回流焊曲线;焊膏选型和印刷量需与1206封装匹配,避免桥连或虚焊。
  • 清洁与维护:常规清洗工艺可接受,但应避免强酸强碱介质长期浸泡。
  • 尺寸与焊盘:遵循1206封装推荐焊盘尺寸,保持焊点边缘均匀,便于可靠焊接与后期焊接检测。

五、可靠性与质量控制

Brightking 系列产品通常通过批次出厂检测,满足 RoHS 等环保要求。建议在关键应用中进行来料检验,包括阻值、温漂、功率承载与高温存储测试等;在量产时应结合加速老化与热循环验证最终可靠性。

六、选型与注意事项

  • 阻值选择应考虑温度漂移与功率裕度,若电路中存在瞬态过载或长期高负载,应留出足够功率余量或使用更大功率封装。
  • 若用于电流检测(低阻值场景),需关注电阻的温度系数(TCR)与感应特性;对精密测量场合建议选择专用低TCR电阻。
  • 订购时确认完整规格(阻值、容差、包装形式等),并与供应商确认出货与技术文件以确保一致性。

总结:SMD1206B050TF/24 以其1206的通用尺寸、600mW的功率能力及工业级工作温度,适合在24V级别的通用电子设备中承担可靠的限流、分压与偏置任务。合理的PCB散热设计与焊接工艺能显著提升其长期稳定性。若需替代或更高规格,建议根据实际功耗与热设计选择更高功率或更低温漂的型号。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.