WMSIC Electronic Components

Brightking 5.0SMDJ15CA/TR13 5.0SMDJ15CA

Model5.0SMDJ15CA/TR13
PackageSMC(DO-214AB)
BrandBrightking
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Brightking 5.0SMDJ15CA / TR13
Type
SMC(DO-214AB)
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Brightking
Electronic Component
5.0SMDJ15CA/TR13
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.371g
Electronic Component
1
Electronic Component
BM0257689060
Operating Temperature
55℃~+150℃
Voltage
24.4V
Current(Ir)
100uA
Voltage(VBR)
16.7V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

5.0SMDJ15CA/TR13 产品概述

一、产品简介

5.0SMDJ15CA/TR13 是 Brightking(台湾君耀)出品的一款双向瞬态电压抑制器(TVS),封装为 SMC (DO-214AB)。器件针对瞬态过压冲击提供快速钳位保护,典型适用于需要高能量吸收能力的电源线与信号线保护场景。该型号在结构与特性上兼顾高浪涌耐受与低反向漏电,适应宽温度范围的工业级应用。

主要电气参数(典型/标称):

  • 极性:双向
  • 反向截止电压 Vrwm:15 V
  • 钳位电压 Vc:24.4 V
  • 峰值脉冲电流 Ipp(8/20μs):205 A
  • 峰值脉冲功率 Ppp(8/20μs):5 kW
  • 击穿电压(典型):16.7 V
  • 反向电流 Ir:100 μA
  • 工作温度:-55 ℃ ~ +150 ℃
  • 封装:SMC (DO-214AB)

二、主要特性与优势

  • 高能量吸收:5 kW 峰值脉冲功率与 205 A 峰值脉冲电流能有效吸收雷击或开关瞬态带来的大能量冲击。
  • 双向保护:对正负极对称钳位,适合交流线路或双向瞬态场合,无需额外极性处理。
  • 宽温度工作:-55 ℃ 到 +150 ℃,满足严苛工业与汽车温度环境要求。
  • 低静态漏电:典型反向电流 100 μA,在常态下保持较低损耗,利于对敏感电路的影响最小化。
  • SMC 封装:表面贴装形式,适配自动化贴装与回流焊工艺,便于在 PCB 上实现低感抗布线。

三、典型应用场景

  • 工业电源与配电系统的浪涌保护
  • 通信设备、基站和传输链路的防雷、防浪涌设计
  • 汽车电子子系统需要的瞬态抑制(如车载充电模块、控制单元)
  • 逆变器、UPS、太阳能逆变等电力电子系统的输入/输出保护
  • 高功率接口、连接器与电缆入口的局部保护

四、设计与安装建议

  • 靠近被保护节点:将 TVS 靠近接口或被保护元件放置,缩短走线以减少寄生电感,从而降低峰值钳位电压。
  • 散热要求:SMC 封装在大电流冲击时会产生热量,建议在器件两侧及底部留出足够铜箔面积以利于散热,必要时采用多层铜平面导热。
  • PCB 布线:对地或对线布线应尽量短且直接,避免环路与长走线;若为板间多点保护,可考虑专用接地过孔以分流热量与电流。
  • 与其他保护元件配合:在需要时可与限流电阻、熔断器或PTC配合使用,以实现级联保护并限制再生能量或连续过流。

五、可靠性与注意事项

  • 热循环与老化:长时间承受频繁高能脉冲会影响寿命,设计时应评估实际浪涌频率并预留裕量。
  • 反向漏电随温度上升而增加,在高温环境下需重新评估对电路的影响。
  • 选型提示:确保 Vrwm(15 V)高于系统工作电压但低于可允许的受损电压。钳位电压 24.4 V 为典型值,实际电路中应保证下游元件耐受该钳位水平。

六、封装与供应信息

  • 封装:SMC (DO-214AB),适合自动贴装与回流焊。
  • 包装及批量:通常提供卷带或托盘包装,适配产线贴装需求。具体供货形式与最小起订量可与供货商确认。

总结:5.0SMDJ15CA/TR13 以其 5 kW 的瞬态能量吸收能力、双向钳位结构与宽工作温度,成为工业、通信与汽车等需高可靠性浪涌保护场合的理想选择。在电路设计中应注意布局与散热,以发挥器件最佳保护性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.