WMSIC Electronic Components

Brightking SMD1206B175TF

ModelSMD1206B175TF
Package1206
BrandBrightking
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Brightking SMD1206B175TF
Type
BRIGHTKING
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Brightking
Electronic Component
SMD1206B175TF
Electronic Component
1
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.178g
Electronic Component
1
Electronic Component
500ms
Electronic Component
BM0239712151
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
800mW
Current(Imax)
100A
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1206B175TF 自恢复保险丝(1206 封装,1.75A)

一、主要参数

  • 型号:SMD1206B175TF
  • 品牌:Brightking(台湾君耀)
  • 封装:1206(约 3.2 mm × 1.6 mm)
  • 最大工作电压 Vmax:6 V
  • 最大冲击电流 Imax:100 A(非连续、瞬态承受)
  • 保持电流 Ihold:1.75 A(在规定环境下不动作的最大稳态电流)
  • 跳闸电流 Itrip:3.5 A(电流升高到该值时将在规定时间内动作)
  • 动作时间:500 ms(典型动作响应时间)
  • 功耗 Pd:800 mW(环境与散热条件下的最大允许功耗)
  • 初始态阻值 Rmin:20 mΩ(常态低阻)
  • 跳断后阻值 R1max:90 mΩ(动作后阻值上限)
  • 工作温度范围:-40 ℃ 至 +85 ℃
  • 类型:自恢复(PTC)表面贴装保险丝

二、产品概述与特性

SMD1206B175TF 是为低压、可重复保护设计的表面贴装自恢复保险丝。器件在正常工作电流下呈现低阻状态(典型初始阻值约 20 mΩ),当过电流超过其跳闸点(约 3.5 A)并持续一定时间(典型 500 ms)时,内部材料加热产生电阻显著上升(动作后阻值 ≤ 90 mΩ),限制故障电流,从而保护电路。故障解除且冷却后可自动恢复到低阻态,适合多次保护循环使用。

主要特性:

  • 小尺寸 1206 SMD,兼容自动贴片与回流焊工艺
  • 低初始电阻,适用于电源及地线保护,减少稳态功耗
  • 较高的瞬态承受能力(Imax 可达 100 A),能够吸收短时浪涌
  • 宽温度工作范围,适用多种环境

三、典型应用场景

  • USB 电源保护(USB-A/USB-C VBUS 侧)
  • 移动设备与便携式电子设备的充电线路保护
  • LED 驱动与照明电源防护
  • 电池包、移动电源的输出与充电保护(非主断路)
  • 工业控制、通信设备的局部过流保护
  • 作为电源输入端的第一道防护,配合其它保护元件构成多层防护策略

四、选型与设计建议

  • 保持裕量:实际稳态电流应低于 Ihold,建议留 20%~50% 余量(例如稳态电流 ≤ 1.4 A)以避免在高温或异常工况下误动作。
  • 考虑温度影响:环境温度越高,器件更易热化,从而降低有效保持电流。高温环境下应增加裕量或选更高等级型号。
  • 功率与散热:Pd=800 mW 表示在指定条件下的最大耗散能力。若电路阻值或周边布线导致局部发热,会影响动作行为。设计中应保证良好散热路径,避免与热敏元件并列紧贴。
  • 冲击电流:Imax=100 A 代表短时浪涌承受能力,但不能作为持续导通能力。对有频繁大浪涌的系统,需评估寿命影响并考虑外加限流元件。
  • 阻值变化:跳闸后阻值上升至 ≤90 mΩ,可限制故障电流但仍存在一定泄漏;若需要完全断开,应与机械保险或高速断路器搭配。

五、PCB 布局与焊接建议

  • 放置位置:靠近电源输入或保护点,作为首级保护元件。
  • 引脚走线:尽量使用较宽铜箔以降低串联电阻和改善散热。
  • 布局注意:避免将热敏器件(如电容、IC)紧邻自恢复保险丝,减少热干扰。
  • 回流焊工艺:遵循制造商的回流温度曲线与焊接温度极限,常规 1206 SMD 可使用标准回流工艺;建议在首批量产前进行焊接性和功能性验证。
  • 包装方式:常见为卷带(Tape & Reel),便于贴片机使用。

六、可靠性与测试建议

  • 建议在目标应用环境下进行循环动作测试和高温寿命测试,确认长期稳定性与恢复性能。
  • 对于关键保护点,建议进行故障仿真(短路持续时间、重复浪涌)以评估器件承受能力与系统行为。
  • 检查在最大允许环境温度 (+85 ℃) 下的动作边界,确保不会因环境而误动作导致系统不可用。

七、选型总结

SMD1206B175TF 适合用于 6 V 以下、需要小体积、可重复过流保护的消费类与工业电子设备。当设计电流接近或超过 1.75 A 时,应选用保持电流更高的型号或增加安全裕度;在高温或频繁浪涌场合,建议通过测试验证或选用更高额定值的自恢复保险丝。该器件结合小体积、较低初始阻值与良好瞬态承受力,在 USB、电池保护与小电流电源防护中具有良好适用性。

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