WMSIC Electronic Components

Brightking UDT23A12L02

ModelUDT23A12L02
PackageSOT-23
BrandBrightking
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Brightking UDT23A12L02
Type
BRIGHTKING
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Brightking
Electronic Component
UDT23A12L02
Electronic Component
1
Package
SOT-23
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.052g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.8pF
Electronic Component
BM0264881708
Operating Temperature
55℃~+150℃
Voltage
25V
Electronic Component
IEC 61000-4-2
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

UDT23A12L02 产品概述

UDT23A12L02 是 Brightking(台湾君耀)推出的一款超低电容双路 TVS 阵列,专为保护高速数据接口而设计。器件以极低结电容(Cj ≈ 0.8 pF)和高脉冲抑制能力为特色,能在不影响信号完整性的前提下,有效钳位瞬态过电压,保护敏感芯片免受 ESD、CDE 与 EFT 损害。

一、主要特性

  • 反向截止电压 Vrwm:12 V(典型)
  • 击穿电压 VBR:约 13.3 V
  • 峰值脉冲功率 Ppp:400 W(8/20 μs)
  • 钳位电压:25 V(典型)
  • 反向漏电流 Ir:1 μA(最大)
  • 通道数:双路(双线保护)
  • 结电容 Cj:约 0.8 pF(单通道)
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 防护等级:符合 IEC 61000-4-2 静电放电标准
  • 封装:SOT-23,贴片封装,便于空间受限应用

二、优势说明

超低电容设计使得该器件对高速信号的影响极小,适用于工作频率超过 3 GHz 的接口;高达 400 W 的 8/20 μs 峰值能量吸收能力,保证在强瞬变干扰下仍能快速钳位并将能量耗散到地;低漏电流适合对偏置要求高的应用场景。

三、典型应用

  • 高速串行接口:USB 3.x、HDMI、DP、MIPI
  • 通信与网络设备:以太网 PHY、光模块接口
  • 移动终端及便携设备:智能手机、平板、相机等高速数据线防护
  • 工业与仪表:高速采集通道与传输线保护

四、封装与布局建议

  • 建议靠近受保护的连接器或芯片引脚放置 TVS,走线最短并直接返回到地;
  • 保持地回路低阻抗,尽量使用多层板地平面;
  • 对差分对或高速单端信号,注意匹配阻抗及布线对称性以减少插入损耗;
  • SOT-23 小型封装适合空间受限设计,但需注意焊接工艺以避免短路与冷焊。

五、使用注意事项与合规

  • 器件为双路 TVS 阵列,按数据手册连接对应信号与地(本型号为反向截止/单向保护,请在设计时确认信号极性需求);
  • 虽符合 IEC 61000-4-2,实际系统防护效果受 PCB 布局、接地和外壳屏蔽影响,建议在整机级别进行可靠性验证;
  • 在高能脉冲或重复冲击场合下,请验证热耗散与长期可靠性;如需更多电气特性曲线或推荐封装尺寸与 PCB 尺寸,请参考 Brightking 官方数据手册或联系供应商技术支持。

UDT23A12L02 以其低电容、高能量吸收和小型封装特性,为高速数据线提供高效、低影响的瞬态过压保护,是移动通信、消费电子与高速接口设计的理想选择。

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