WMSIC Electronic Components

Brightking SMD2920B300TF/15 SMD2920B300TF

ModelSMD2920B300TF/15
Package2920
BrandBrightking
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Brightking SMD2920B300TF / 15
Type
2920
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Brightking
Electronic Component
SMD2920B300TF/15
Electronic Component
1
Electronic Component
5.44mm
Package
2920
Electronic Component
Resettable Fuse
Electronic Component
0.178g
Electronic Component
7.98mm
Electronic Component
1.8mm
Electronic Component
1
Electronic Component
20s
Electronic Component
BM0257694868
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
15V
Power(Pd)
1.5W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD2920B300TF/15 — 自恢复保险丝(PPTC)产品概述

一、产品简介

SMD2920B300TF/15 是台湾 Brightking(君耀)推出的一款表面贴装型自恢复保险丝(PPTC),封装为 2920,面向板级过流保护设计。该器件在正常工作时保持低阻抗,当发生过流或短路时快速增阻限流,故障解除并冷却后可自动恢复导通能力,适用于多种低压直流供电系统的保护需求。

关键规格一览:

  • 耐压(Vmax):15 V
  • 保持电流(Ihold):3 A
  • 跳闸电流(Itrip):5 A
  • 最大瞬时耐受电流(Imax):40 A
  • 功耗(Pd):1.5 W
  • 初始态阻值(Rmin):12 mΩ
  • 跳断后阻值(R1max):48 mΩ
  • 动作时间:20 s(在指定过流条件下)
  • 工作温度范围:-40 ℃ 至 +85 ℃
  • 外形尺寸(L×W×H):7.98 mm × 5.44 mm × 1.8 mm
  • 封装:2920(SMD)

二、主要特性

  • 自恢复功能:发生过流或短路时,器件内部温度升高使材料从低阻态变为高阻态,限制电流并保护下游电路;故障消除后可自动冷却回复初始阻值,省去更换元件的维护成本。
  • 低初始电阻:初始阻值仅 12 mΩ(典型),对正常工作时的串联电压降与功耗影响小,适合电源路径或负载侧保护。
  • 短时冲击承受能力:器件能承受高达 40 A 的瞬时冲击电流(需按厂商曲线确认具体冲击持续时间与频次),对具有启动浪涌或短时电流尖峰的系统更为适用。
  • 紧凑表贴封装:2920 SMD 封装,便于自动贴装与批量生产,适合板级设计与空间受限场合。

三、电气参数含义与使用注意

  • Ihold(3 A):在此电流及以下,器件应长期保持低阻态,不会触发跳闸。选型时应保证最大工作电流在 Ihold 以下有足够裕量。
  • Itrip(5 A):在此电流水平下并持续足够时间,器件会进入高阻态以限制电流。Itrip 与环境温度、PCB 散热、过流持续时间相关。
  • Pd(1.5 W):表示在正常工作状态下器件可耗散的功率上限,超过此值会导致温度升高进而触发跳闸。设计时需考虑串联电阻与电流带来的功耗。
  • 初始与跳断后阻值:12 mΩ→48 mΩ 的阻值变化说明跳断后仍保有一定残余阻值,恢复前应避免多次重复触发以防热累积。

四、典型应用场景

  • USB、电源线保护:用于 5–15 V 的外部供电接口,保护下游电路免受短路或过流损害。
  • 电池保护与便携设备:用于移动设备、便携仪表的输入侧或模块间电源保护,适配充电电路或负载隔离。
  • 工业控制与板级保护:DC-DC 模块、传感器电源、继电器和电机驱动的过流防护(需评估启动电流与 Itrip 差异)。
  • 家电与消费电子:用于小家电、充电器、机顶盒等产品的内部短路保护。

五、PCB 布局与安装建议

  • 热管理:自恢复保险丝的触发与恢复与散热密切相关。建议在器件两端留足铜箔面积以利散热,并避免将散热路径完全隔离在热阻较大的狭小铜箔上。
  • 布线:尽量采用宽短走线以降低串联电阻和寄生发热,避免走线经过高温元件或热源。
  • 安装方向与机械保护:SMD 器件在回流焊后应避免在高振动或频繁机械应力环境中直接暴露,必要时使用胶固定或添加支撑结构。
  • 焊接工艺:采用推荐的回流焊工艺参数进行焊接,遵循制造商的温度曲线与分步说明。若需手工焊接或二次加工,务必控制局部温度与时间,避免损坏内部结构。

六、选型与验证建议

  • 留有裕量:系统持续工作电流应低于 Ihold,建议按环境温度、老化及容差留 20–30% 以上裕度。
  • 考虑浪涌与启动电流:如果存在较大启动电流或反复浪涌,应评估器件的 Imax 能否承受并查看厂方浪涌曲线,必要时并联专用限流或选择更大规格的 PPTC。
  • 实地验证:在目标系统的真实工况(最高环境温、最大负载、振动等)下做过流触发与恢复测试,确认动作时间、恢复特性和重复触发后的行为满足要求。
  • 咨询资料:在最终设计前,请参考 Brightking 官方数据手册和典型应用说明以获得完整的电气曲线与回流焊工艺规范。

总体而言,SMD2920B300TF/15 以其低阻、可自恢复和片式封装的特点,适合用于 15 V 以内的多种板级保护场合。合理的电流裕度、热设计与测试验证是保证其长期可靠运行的关键。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.