WMSIC Electronic Components

Brightking SMD2016B200TF

ModelSMD2016B200TF
PackageSMD
BrandBrightking
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Brightking SMD2016B200TF
Type
BRIGHTKING
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Brightking
Electronic Component
SMD2016B200TF
Electronic Component
1
Electronic Component
4.43mm
Package
SMD
Electronic Component
Resettable Fuse
Electronic Component
0.178g
Electronic Component
5.44mm
Electronic Component
1.2mm
Electronic Component
1
Electronic Component
3s
Electronic Component
BM0259733030
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
1.4W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Brightking SMD2016B200TF 贴片自恢复保险丝产品概述

一、核心身份与封装定位

SMD2016B200TF是台湾君耀(Brightking)推出的贴片式自恢复过流保护器件,采用行业标准SMD2016封装(公制尺寸:长5.44mm×宽4.43mm×高1.2mm),属于小型化贴片元器件范畴。其核心功能是在电路过流时自动断开保护,故障排除后无需人工干预即可恢复导通,适配自动化表面贴装工艺,满足高密度PCB设计需求。

二、关键电气参数深度解析

SMD2016B200TF的参数针对低电压、中等电流场景优化,核心性能清晰可控:

2.1 耐压与电流保护特性

  • 最大耐压(Vmax):6V,适配3.3V、5V等主流低电压系统,避免高压击穿风险;
  • 保持电流(Ihold):2A,即正常工作时电路电流≤2A则保持导通,不影响系统运行;
  • 跳闸电流(Itrip):4.2A,电路电流超过此值时启动保护;
  • 最大过载电流(Imax):40A,可承受瞬间浪涌(如开机电容充电),避免误触发。

2.2 电阻与功率损耗

  • 初始态最小阻值(Rmin):30mΩ,低阻设计减少正常工作时的功率损耗,提升系统效率;
  • 跳断后最大阻值(R1max):100mΩ,故障排除后阻值恢复至低水平,不影响后续电路工作;
  • 消耗功率(Pd):1.4W,额定电流下功耗可控,适配小功率敏感系统。

2.3 动作时间与温度范围

  • 动作时间:3s(超过Itrip时),精准时间避免瞬间浪涌误跳闸,提升系统稳定性;
  • 工作温度:-40℃~+85℃,宽温特性适应工业低温、消费电子高温等多场景。

三、典型应用场景适配

基于参数特性,该产品主要覆盖以下场景:

  1. 消费电子:手机、平板、智能穿戴的电池保护电路(电池输出电流≤2A);
  2. 小型工业:低电压控制电路、传感器模块、小型电机驱动的过流保护;
  3. 车载低电压系统:车载USB接口、充电器、小型娱乐设备的保护(适配12V系统低压段);
  4. 通信设备:路由器、交换机、光模块的端口过流保护。

四、封装与物理特性细节

SMD2016B200TF的封装设计兼顾小型化与可靠性:

  • 尺寸:长5.44mm×宽4.43mm×高1.2mm,体积小巧节省PCB空间;
  • 工艺:符合RoHS标准,适配无铅焊接,支持自动化贴装;
  • 结构:贴片式设计,可直接集成于高密度PCB,无需额外布线。

五、性能优势总结

该产品的核心竞争力体现在:

  • 精准保护:Ihold(2A)与Itrip(4.2A)比值合理,动作时间明确,避免误触发;
  • 低损耗:初始30mΩ阻值减少正常工作功耗,提升系统效率;
  • 自恢复特性:故障排除后自动导通,无需更换,降低维护成本;
  • 宽温可靠:-40℃~+85℃适应多环境;
  • 量产适配:贴片封装支持自动化生产,适合批量应用。

SMD2016B200TF是低电压、中等电流场景下的高性价比过流保护方案,可有效提升电路可靠性。

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