Model & package intelligence
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BORN PESD3V3L1BA-N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN PESD3V3L1BA-N
- Type
- BORN
- Minimum package
- 3000
Technical parameters
- Electronic Component
- BORN
- Electronic Component
- PESD3V3L1BA-N
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Cj- Capacitor
- 100pF
- Electronic Component
- BM69416740
- Voltage
- 24V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 1uA
- Voltage(VBR)
- 4V
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PESD3V3L1BA-N 产品概述
一、产品介绍
PESD3V3L1BA-N 是由知名半导体品牌 BORN（伯恩半导体）制造的一款高性能电子元器件。它采用 SOD-323 封装，设计用于提供过压保护，特别适用于低压应用。这款元件具有较高的功率处理能力，额定功率可达 350W，使其能够有效应对突发的电压尖峰和瞬态过电压。
二、技术特点
双向保护： PESD3V3L1BA-N 具有双向保护功能，能够在正负两方向上提供稳定的过电压保护。这使得该器件特别适合于需要避免反向电压损害的应用，例如信息和通信系统中的信号线保护。
额定反向击穿电压：该器件的额定击穿电压（VBWM）为 3.3V，特别适用于 3.3V 的电源和信号系统。对于一般的低压电路，能够有效防止电压超出安全范围时对元器件造成的损害。
瞬态电流承载能力：根据产品规格，PESD3V3L1BA-N 能够承受持续的空气放电达 30kA 和电接触放电达 30kA。这意味着即使在极端的电压冲击情况下，该器件仍能保持稳定的性能，确保下游设备的安全运行。
小型封装：采用 SOD-323 封装，使得数量较多的小型电子设备也能轻松集成这一保护器件。小型化的设计不仅节省了电路板空间，也为更紧凑的设备设计提供了更多灵活性。
优异的热性能：PESD3V3L1BA-N 的热管理能力较强，能够迅速散热，提高其可靠性和耐用性。这对于长时间运行或电流波动较大的应用至关重要。
三、应用场景
PESD3V3L1BA-N 可广泛应用于各种电子设备中，尤其是在需要保护敏感元件的领域。以下是一些典型的应用场景：
移动设备：在智能手机、平板电脑等移动设备中，提供对小信号线和电源线的过压保护，防止静电放电（ESD）对敏感组件造成损害。
通信设备：在网络路由器、交换机、基站等通信设备中，保护数据传输线路，确保在恶劣电气环境下的可靠通信。
汽车电子：在汽车电子控制单元（ECU）中，PESD3V3L1BA-N 决定了在电磁干扰和静电放电的环境中元件的传输安全。
家用电器：在洗衣机、冰箱等智能家电中，保护适配器和信号传输线路，确保产品正常运行和延长器件的生命周期。
四、总结
综上所述，PESD3V3L1BA-N 是一种具有高功率处理能力和优异电压保护性能的电子元器件，适合于各种低压应用场景。其小型化设计使得它能够方便地集成到各类设备中，而强大的瞬态电流承载能力则保证了在突发电压情况下的安全性。随着智能化和网络化设备的普及，对电压保护元器件的需求日益增长，PESD3V3L1BA-N 将在未来的电子产品中扮演愈加重要的角色。
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