Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN FR107
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN FR107
- Type
- BORN
- Minimum package
- 3000
Technical parameters
- Electronic Component
- BORN
- Electronic Component
- FR107
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.038g
- Electronic Component
- 1
- Electronic Component
- BM69416721
- Current
- 1A
- Current(Ir)
- 5uA@1kV
- (Vf)
- 1.3V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 1kV
- (Trr)
- 500ns
- Surge Current (Ifsm)
- 30A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FR107 产品概述
简介
FR107是一款由BORN（伯恩半导体）制造的快恢复二极管，具有优良的电流/电压特性，适用于多种高效能电路应用。该产品设计用于在高频开关和逆向恢复过程中保持低损失，有效降低功耗，提升电路整体性能，为多种电子设备提供稳定可靠的电流保护。
关键参数
正向电压降：FR107在1A的正向电流下显示出仅1.3V的电压降，这使得它在电源电路中具备较低的功耗，尤其适合高效能电源设计。
反向耐压能力：该二极管具有1kV的反向耐压特性，能够在高电压环境下正常工作，也为设备增加了可靠性和稳定性。这使得FR107在电源管理和电力转换应用中尤其受欢迎。
反向漏电流：在1kV的电压下，仅5uA的反向漏电流进一步加强了它的高效性，适合需要长时间工作的应用场景，如电源变换器和快速充电器等。
封装类型：采用直插式SOD-123封装，紧凑且有利于节省电路板空间。这种封装形式也有助于提高散热性能，确保在高负荷工作时能有效排热。
应用场景
FR107广泛应用于以下领域：
开关电源：由于其快速恢复特性，该二极管在开关电源中起着关键作用，帮助提高效率并降低开关损耗。
逆变器：在逆变器应用中，FR107能够快速响应电流变化，确保系统可靠运行，尤其是在需要频繁切换电流方向的情况下。
充电器：对于快速充电器，FR107的低正向电压降和高反向耐压能力，能够显著改善充电效率，缩短充电时间。
轨道变换：在轨道变换器和电气传动系统中，使用FR107能够有效抑制反向电流，保护电路组件。
信号整流：在信号整流和检测系统中，该二极管的高效率与低损耗优势能够确保信号处理的准确度与稳定性。
总结
FR107快恢复二极管是BORN（伯恩半导体）推出的一款高性能元件，其在多个关键参数上的优秀表现使其成为电源及相关应用的理想选择。无论是在高效能电源设计，逆变器，还是在充电器及其它电子设备中，FR107都能提供线性响应和卓越的可靠性。其紧凑的SOD-123封装不仅便于集成安装，也使得散热管理更为高效。总之，FR107是追求高效率与高可靠性的现代电子设计中不可或缺的元件之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
