Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN PESD5V0S1BA-N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN PESD5V0S1BA-N
- Type
- BORN
- Minimum package
- 3000
Technical parameters
- Electronic Component
- BORN
- Electronic Component
- PESD5V0S1BA-N
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Cj- Capacitor
- 60pF
- Electronic Component
- BM69416741
- Voltage
- 21V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 1uA
- Voltage(VBR)
- 6V
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：PESD5V0S1BA-N
在当今电子设备迅速发展的时代，保护电路不受静电放电（ESD）和电压瞬态的影响显得尤为重要。为此，BORN（伯恩半导体）推出的PESD5V0S1BA-N是一款高性能的双向静电放电保护器件，针对各种电子产品和应用场景提供了优异的保护性能。
一、产品特性
PESD5V0S1BA-N为双向ESD保护器，特别设计用于保护敏感电子元器件免受静电放电和电压瞬态干扰。其主要特性包括：
高ESD保护能力：PESD5V0S1BA-N具有双向的ESD保护能力，符合IEC61000-4-2标准，空中放电接触放电电流可达到30KA，确保在各种环境下的稳定性和可靠性。
宽工作电压范围：该器件的击穿电压为5V，能够有效防止过压对敏感元件的损害，操作电压适合多种应用场合，尤其是在移动设备和通信设备中广泛应用。
小型封装设计：采用SOD-323封装，PESD5V0S1BA-N在占用空间方面表现出色。小型化设计适合于空间有限的应用，如智能手机、平板电脑及各类小型电子设备。
快速响应时间：该器件在面对突发电压时，能够快速响应，从而为被保护的电路提供即时的保护，降低元器件因电压瞬态而受损的风险。
低电容特性：PESD5V0S1BA-N具备低电容特性，减少对信号传输的干扰，保持信号的完整性，尤其适合高速数据线的保护需求。
二、应用领域
PESD5V0S1BA-N在多种应用场景中展现出其卓越的保护能力，包括但不限于：
移动通讯设备：智能手机、平板电脑及各类便携式设备，PESD5V0S1BA-N能够有效保护内部电路及接口，防止因静电放电导致的设备故障。
消费电子：广泛应用于家用电器、游戏设备等消费电子中，保障设备在使用过程中不受外部电压干扰。
汽车电子：电子元件在汽车中的应用越来越普遍，PESD5V0S1BA-N可保护座舱内的电子模块，确保车辆电子系统的稳定运行。
工业设备：在工厂自动化和机械控制系统中，PESD5V0S1BA-N能够保护关键控制电路，降低停机和设备损坏的风险。
网络通信：在网络设备、交换机和路由器中，PESD5V0S1BA-N提供必要的电压保护，保障信号传输的安全性和稳定性。
三、结论
PESD5V0S1BA-N是一款集高性能、高可靠性于一体的双向ESD保护元器件。作为BORN（伯恩半导体）的一员，它以其卓越的抗静电放电能力、小型封装、快速响应时间和低电容特性，为各种电子设备提供了可靠的保护解决方案，确保了其在多种复杂应用中的正常运行。无论是在追求高性能的消费电子产品，还是在严苛环境下工作的工业设备，PESD5V0S1BA-N都能有效延长产品的使用寿命，提升其可靠性，是现代电子设计中不可或缺的重要元件之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
