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BORN B5817WS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN B5817WS
- Type
- BORN
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- B5817WS
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Electronic Component
- BM0229259073
- Current
- 1A
- Diode
- Electronic Component
- (Vf)
- 750mV@3A
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 20V
- Surge Current (Ifsm)
- 9A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B5817WS 产品概述
一、产品简介
B5817WS 为伯恩半导体（BORN）出品的一款肖特基势垒二极管，封装为 SOD-323，标称工作电压 20V，整流电流 1A，具有低正向压降特性（750mV @ 3A）和较高的冲击能力（非重复峰值浪涌电流 Ifsm 9A）。该器件适合用于低压快速整流、反向保护与开关整流等对正向压降和开关速度有要求的场合。
二、主要参数（基于给定信息）
- 封装：SOD-323（小型表贴封装）
- 直流反向耐压 (Vr)：20 V
- 额定整流电流：1 A（连续）
- 正向压降 (Vf)：750 mV @ 3 A（标称）
- 非重复峰值浪涌电流 (Ifsm)：9 A
- 反向电流 (Ir)：（给定值 9A 与常识不符，见下文说明）
三、特性与优势
- 低正向压降：肖特基结型结构使得在低电压差场合能减少功率损耗、提高效率，特别是在电源二次侧或供电保护中能降低发热。
- 快速恢复/无恢复时间：肖特基二极管无传统PN结恢复过程，适合高频整流与开关电路。
- 较高浪涌承受能力：Ifsm = 9A 表明器件能承受短时冲击电流，利于负载突变或短路瞬态场合。
四、封装与热管理要点
SOD-323 为小型贴片封装，优点是占板面积小，但热阻较大，连续 1A 电流下需注意热耗散：
- PCB 设计应在二极管焊盘处增加铜箔面积以改善散热。
- 在靠近热源或高环境温度时，应对最大允许结温进行严格评估并必要时降额使用。
- Vf 标注为 750 mV @ 3 A，仅作为器件特性参考，不应以此作为 1A 连续工作时的唯一判断依据，推荐查阅完整 datasheet 中 Vf 与温度、典型曲线关系。
五、典型应用
- 低压整流与二次侧整流
- 电源方向保护 / 反接保护
- 开关电源输出回路、同步整流辅助或替代
- 电池供电设备、便携设备的电源路径控制
六、使用与选型建议
- 校验数据：给定“反向电流 Ir = 9A”明显不合理（反向漏电通常为 µA~mA 级），请以供应商正式 datasheet 为准，确认 Ir、热阻 RθJA、结温上限等关键项。
- 热设计：在 PCB 上扩大铜箔并考虑散热通道；若工作电流接近额定值，考虑采用更大封装或并联方案。
- 可靠性边界：若长期在高温或高电流脉冲环境使用，优先选择额定电流与功耗裕量更大的型号。
- 替代选择：若需更低 Vf 或更高连续电流，可选用更大功率封装（如 SOD-123、SMA 系列）或低 Vf 的专用肖特基器件。
总结：B5817WS 在小体积低压整流与保护场合具有成本与体积优势，但在选型与布局时需重视热管理并核实 datasheet 中的关键参数，防止因参数误读导致可靠性问题。
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