WMSIC Electronic Components

BORN F1M

ModelF1M
PackageSOD-123FL
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN F1M
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
F1M
Electronic Component
1
Package
SOD-123FL
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0226526744
Current
1A
Current(Ir)
5uA
(Vf)
1.3V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
1kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

F1M 产品概述

一、产品简介

F1M 是 BORN(伯恩半导体)推出的一款小型功率整流二极管,采用 SOD-123FL 贴片封装,适合空间受限的通用整流与浪涌保护场景。器件具有 1A 的持续整流能力与 30A 的非重复峰值浪涌能力,兼顾体积小与耐冲击性能,适用于消费电子、通信电源及汽车电子等领域。

二、主要规格参数

  • 工作结温范围:-55℃ ~ +150℃
  • 正向压降(Vf):1.3V @ 1.0A
  • 直流反向耐压(Vr):1000V
  • 反向电流(Ir):5 μA(典型/最大值,测试条件请参考器件数据手册)
  • 非重复峰值浪涌电流(Ifsm):30A
  • 反向恢复时间(Trr):500ns
  • 整流电流:1A
  • 封装:SOD-123FL
  • 品牌:BORN(伯恩半导体)

三、主要特性

  • 高耐压:1000V 的反向耐压使其适用于高压整流和高压防护场合。
  • 良好浪涌承受能力:Ifsm 达 30A,可应对启动或故障时的短时浪涌电流。
  • 中速恢复:Trr 约 500ns,适合对恢复时间有一定要求但不需要超快速恢复的应用。
  • 宽工作温度:-55℃ 到 +150℃ 满足工业级和严苛环境需求。
  • 小型封装:SOD-123FL 有利于高密度 PCB 布局与自动贴装生产。

四、典型应用场景

  • 开关电源(整流与续流)
  • 功率适配器与电源模块的高压整流
  • 逆变器、变频器中的高压整流支路
  • 浪涌保护与反向保护电路
  • 工业控制与通信设备的电源前端

五、封装与可靠性

SOD-123FL 提供良好的热阻与焊接可靠性,适合回流焊工艺。建议在设计 PCB 时考虑热散逸路径(如铜箔加厚、热铜墩)以优化长期导通损耗与结温控制。器件在高温、大电流冲击下的寿命与参数漂移应按数据手册进行评估与验证。

六、选型建议与使用注意事项

  • 若电路对正向压降非常敏感(需更低 Vf),可考虑肖特基类器件,但其耐压通常较低;本器件适合高压场合。
  • 评估实际电流波形与平均功率损耗,计算结温并留有安全裕量(尤其在高环境温度下)。
  • 浪涌电流计算应考虑重复冲击条件,Ifsm 为非重复峰值,重复脉冲需选用更大裕度或并联/替换方案。
  • 参考 BORN 官方数据手册以获取完整电气特性曲线与封装尺寸,用于热设计与可靠性验证。

如需规格表、典型电路示例或与替代型号对比,我可继续提供。

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