WMSIC Electronic Components

BORN B0524P

ModelB0524P
PackageDFN-10(2.5x1.0)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN B0524P
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
B0524P
Electronic Component
1
Package
DFN-10(2.5x1.0)
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.109g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.7pF
Electronic Component
BM0226526720
Operating Temperature
55℃~+125℃
Voltage
20V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B0524P 产品概述

一 概述

B0524P 是 BORN(伯恩半导体)推出的四通道双向瞬态抑制二极管(TVS),封装为 DFN-10L(2.5 × 1.0 mm)。器件针对高带宽接口的静电与浪涌保护进行了优化,兼顾低结电容与高吸收能力,适合 HDMI、USB3.0、DisplayPort 等高速信号线的防护设计。

二 主要参数

  • 类型:ESD 双向 TVS,四路保护
  • 钳位电压(Vc):20 V(典型)
  • 反向工作电压 Vrwm:5 V
  • 击穿电压(Vbr):6 V
  • 峰值脉冲功率 Ppp:100 W(8/20 μs)
  • 峰值脉冲电流 Ipp:5 A(8/20 μs)
  • 结电容 Cj:0.7 pF(单通道典型)
  • 反向电流 Ir:≤1 μA
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 符合防护等级:IEC 61000-4-2 / IEC 61000-4-4 / IEC 61000-4-5
  • 封装:DFN-10(2.5 × 1.0 mm)
  • 通道数:4 路,极性:双向

三 特性与优势

  • 低结电容:约 0.7 pF,最大限度减少对高速信号的影响,保证信号完整性,适配 HDMI/USB3.0/DP 等高速差分对。
  • 高效能吸收:100 W(8/20 μs)能量承受能力及 5 A 峰值电流,能对典型 ESD 和浪涌事件提供实时钳位保护。
  • 双向保护:适用于需双向信号传输的接口,免去方向性选择带来的额外电路复杂度。
  • 小型封装:DFN-10L 紧凑尺寸有利于移动设备与板上空间受限的方案,实现多通道并列布局。
  • 低漏电流:Ir ≤1 μA,适配电源敏感或低功耗应用,不影响系统待机功耗。

四 典型应用

  • HDMI、USB3.0、DisplayPort 等高速数据接口的 ESD 与浪涌防护
  • 手机、平板与笔记本的外设接口保护
  • 工业与汽车领域的通信线路及控制信号保护(在温度范围内工作)
  • 电脑主板、摄像头模组、消费类电子产品接口保护方案

五 设计建议与封装信息

  • 布局建议:将 B0524P 靠近受保护接口引脚放置,最短回流路径连接到地平面;为保证最佳性能,推荐在每个信号线与 TVS 之间保持对称且最短的走线。
  • 接地处理:采用完整的地平面并尽量减少分割,必要时为敏感信号添加旁路或滤波元件以进一步改善干扰抑制。
  • 热与机械:DFN-10L 小封装热阻较高,若在高能量环境中频繁吸收浪涌,需评估散热与可靠性。
  • 封装与焊接:兼容常见贴片回流焊工艺,推荐参考厂商提供的 PCB land pattern 与回流曲线。

六 注意事项

  • 请在实际设计中参考 BORN 提供的详尽数据手册与典型特性曲线,验证钳位电压随电流变化的具体数值。
  • 在长期或高能量冲击场景下,应考虑并联或更高规格的浪涌保护方案以提高可靠性。
  • 本产品对静电快速响应,务必在生产与调试过程中做好静电防护措施,避免误伤器件。

B0524P 凭借低容、高能量吸收与紧凑封装,为对信号完整性要求高且空间受限的接口防护提供了可靠且经济的解决方案。若需器件封装图、典型等效电路或更多电气特性曲线,请联系供应商获取完整数据手册。

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