Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN SMBJ3.3CA
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SMBJ3.3CA
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SMBJ3.3CA
- Electronic Component
- 1
- Package
- DO-214AA(SMB)
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.172g
- Electronic Component
- 1
- Electronic Component
- BM0226248332
- Operating Temperature
- 55℃~+150℃
- Voltage
- 8.7V
- Current(Ir)
- 200uA
- Voltage(VBR)
- 7V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMBJ3.3CA 产品概述
一、产品简介
SMBJ3.3CA 为 BORN（伯恩半导体）出品的双向瞬态电压抑制二极管（TVS），封装为 DO-214AA（SMB）。器件针对汽配、电信、工业及消费类电子等需要对线路瞬态浪涌保护的场合设计，可在 ±3.3V 工作电压等级下提供高能量吸收能力与可靠防护。
二、主要电气参数
- 反向截止电压 Vrwm：3.3V（双向）
- 击穿电压 Vbr：7V（典型）
- 钳位电压 Vc：8.7V @ Ipp 69.1A
- 峰值脉冲功率 Ppp：600W（10/1000μs 波形）
- 峰值脉冲电流 Ipp：69.1A
- 反向电流 Ir：200μA（在 Vrwm 条件下）
- 工作温度范围：-55℃ ～ +150℃
- 极性：双向
三、特点与优势
- 双向结构，可直接用于交流或反向可能出现的脉冲抑制，无需额外极性考虑。
- 600W（10/1000μs）高能量吸收能力，适合雷击感应与开关瞬态。
- 低钳位电压（8.7V @69.1A），能有效限制瞬态过压，保护敏感器件。
- 宽温度工作范围，满足恶劣环境下长期可靠性要求。
- SMB 贴片封装，便于自动化贴装与高密度 PCB 布局。
四、典型应用场景
- 电源线路与信号线上对浪涌、雷击感应和静电放电的保护
- 汽车车载电子（需验证 AEC 等级）
- 通信基站、电信接口保护
- 工业控制设备、电机驱动和配电系统的过压保护
- 消费电子中的 USB、HDMI、音视频信号线保护
五、封装与布局建议
- 封装：DO-214AA（SMB），建议按厂商推荐的焊盘尺寸进行 PCB 设计，确保良好热散与机械强度。
- 布局：尽量缩短 TVS 到被保护节点的连接线，地线采用宽而短的回流路径，必要时考虑多层地平面以提高散热与抗干扰性能。
- 散热：在高能量吸收应用中留意 PCB 散热面积，必要时在靠近器件处加大铜箔面积或使用热过孔。
六、使用与存储注意事项
- 器件为瞬态吸收元件，不宜作为连续电流器件使用；若线路可能长期承受较大电流，应选用合适额定的稳压或限流元件配合。
- 安装过程避免过热，遵循回流焊工艺温度曲线，防止封装和内部结构损伤。
- 存储环境应避免潮湿与强腐蚀气体，若产品为领带盘装（tape & reel）并标注为防潮包装，请在规定时间内回流焊接。
七、订购信息
型号：SMBJ3.3CA
品牌：BORN（伯恩半导体）
封装：DO-214AA（SMB）
如需批量采购或获取完整器件参数表（IV 曲线、能量曲线、尺寸图、可靠性测试报告等），建议联系经销商或厂商获取最新版数据手册与样品验证资料。
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