WMSIC Electronic Components

BORN ESD5Z7.0T1G

ModelESD5Z7.0T1G
PackageSOD-523
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN ESD5Z7.0T1G
Type
BORN
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
ESD5Z7.0T1G
Electronic Component
1
Package
SOD-523
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.015g
Electronic Component
1
Cj- Capacitor
100pF
Electronic Component
BM0257674542
Voltage
25V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1uA
Voltage(VBR)
8V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD5Z7.0T1G 产品概述

一、产品简介

ESD5Z7.0T1G 是 BORN(伯恩半导体)推出的一款单线单向瞬态电压抑制(TVS)二极管,封装为超小型 SOD-523,针对瞬态过压、静电放电(ESD)与脉冲浪涌保护优化。该器件具有 7V 的反向工作电压(Vrwm)、约 8V 的击穿电压(Vbr),在 8/20μs 波形下能够承受高达 400W 的峰值脉冲功率(Ppp),并能提供约 25V 的钳位电压(VC),适用于对空间和成本敏感的电路中对单线端口提供可靠防护。

二、主要电气参数(关键值)

  • 极性:单向(Unidirectional)
  • 反向工作电压 Vrwm:7V
  • 击穿电压 Vbr:8V(典型)
  • 钳位电压 VC:25V(在指定脉冲条件下)
  • 峰值脉冲电流 Ipp:15A
  • 峰值脉冲功率 Ppp:400W @ 8/20μs
  • 反向漏电流 Ir:1μA(典型)
  • 结电容 Cj:100pF
  • 防护等级 / 标准:符合 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)、IEC 61000-4-5(浪涌)
  • 封装:SOD-523(超小型表面贴装)

三、产品特点与优势

  • 小体积高能量吸收:SOD-523 封装适合空间受限的移动终端、便携设备与物联网模块。
  • 高瞬态抑制能力:400W(8/20μs)吸收能力能应对常见的浪涌和脉冲事件,15A 峰值脉冲电流满足短时高能干扰。
  • 低反向漏电:1μA 的低漏电有利于对低功耗电路的影响最小化。
  • 单线单向保护:针对信号线或电源线提供极性方向明确的防护,适合有明确接地/参考的应用场景。
  • 工业级抗干扰认证:满足 IEC 61000 多项抗扰标准,便于整机通过电磁兼容认证。

四、典型应用场景

  • 移动终端与便携设备的外部接口(耳机、数据线、充电口)
  • USB/串口等单线数据接口的静电与浪涌防护(需注意结电容对高速信号的影响)
  • 传感器、无线模块的 I/O 保护与引脚防护
  • 汽车内饰电子、工业控制中对单线接口的瞬态保护(请参照汽车级规范进一步确认)
  • 工业设备的输入输出端口、按键或电源线上作为局部防护器件

五、设计与布局建议

  • 放置位置:尽可能靠近受保护的连接器或引脚,缩短受保护线到 TVS 的走线长度,以减少串联电感和提高响应速度。
  • 接地处理:SOD-523 无独立散热基片,需将器件一侧连至 PCB 地平面;保证地线短、粗、低阻抗,必要时在器件附近配置旁路/去耦电容与地通过孔(via)形成低阻回路。
  • 极性连接:单向 TVS 的阳极(Anode)应接地,阴极(Cathode)接被保护的正向线路(即被保护线接在器件阴极,器件正向向地钳位)。在 PCB 严格遵守器件封装标记与原理图连线,避免反向失效。
  • 信号完整性:结电容约 100pF,属于中等值;对高数据速率(如 USB 2.0、LVDS、高速串行链路)可能引入可测量的负载与失真,应评估是否采用更低电容的专用保护器件或将 TVS 放置在非关键路径处。

六、热与可靠性注意事项

  • 瞬态保护器件设计用于脉冲事件,不应作为持续导通元件使用。长时间高能量事件会导致器件热失效。
  • 浪涌功率 Ppp 为 400W(8/20μs),仅在脉冲标准波形与规定重复频率下有效;在多次重复冲击或非标波形下需要额外裕量与热管理。
  • 严格按照制造商推荐的回流焊温度曲线进行贴装,避免超温或过长的加热时间影响器件可靠性。

七、选型与合规性建议

  • 若系统工作电压或信号幅值高于 Vrwm 7V,应选用更高 Vrwm 的型号以避免误触发。
  • 高速接口或对电容敏感的应用应优先考虑低 Cj 型号或在 TVS 前后加隔离/缓冲电路。
  • ESD5Z7.0T1G 已通过 IEC 61000-4-2/4-4/4-5 等标准测试,适合需要满足这些抗扰标准的设备,但整机认证仍需结合布局、接地与其它保护策略一并验证。

总体而言,ESD5Z7.0T1G(SOD-523)为一款体积小、能量吸收能力强、适合面向单线接口的单向 TVS 器件。设计时应重点关注器件与地的连接、结电容对信号的影响以及瞬态功率的应用边界,以确保整机获得最佳的过压与静电防护效果。若需完整的封装图、焊盘建议与详细典型电路,请参考 BORN 官方数据手册。

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