WMSIC Electronic Components

BORN ESD5B5.0ST1G-N

ModelESD5B5.0ST1G-N
PackageSOD-523
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN ESD5B5.0ST1G-N
Type
BORN
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
ESD5B5.0ST1G-N
Electronic Component
1
Package
SOD-523
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.016g
Electronic Component
1
Cj- Capacitor
8pF
Electronic Component
BM0226248493
Voltage
15V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
200nA
Voltage(VBR)
6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD5B5.0ST1G-N 产品概述

ESD5B5.0ST1G-N 是 BORN(伯恩半导体)推出的超小型双向瞬态防护二极管,针对5V工作电压系统优化,提供可靠的静电放电(ESD)和脉冲浪涌保护。器件采用小体积封装,低结电容和低漏电特性,适合移动终端、接口与高速数据线的保护需求。

一、主要特点

  • 钳位电压(VCL):15 V(典型或最大值,取决于测试条件)
  • 击穿电压(VBR):6 V
  • 反向截止电压 Vrwm:5 V(适用于 5V 总线侧的工作电压)
  • 峰值脉冲功率 Ppp:75 W(8/20 μs 波形)
  • 峰值脉冲电流 Ipp:5 A(8/20 μs)
  • 反向漏电流 Ir:200 nA(常温)
  • 结电容 Cj:8 pF(适合高速信号线)
  • 极性:双向(无极性,适合同轴或双向数据线)
  • 类型:ESD 抑制二极管(TVS)
  • 防护等级:符合 IEC 61000-4-2/4-4/4-5 标准
  • 封装:SOD-523(超小型封装,标注时亦见 SOT-523 表示)

二、典型优势

  • 低结电容(8 pF):对高速接口影响小,可用于 USB、串口、摄像头接口等高速信号保护
  • 低漏电(200 nA):在低功耗系统中对静态电流影响微小
  • 高瞬态吸收能力(75 W@8/20 μs):能承受工业级浪涌和 ESD 冲击
  • 双向结构:无需判断极性,方便 PCB 布局和自动化贴装

三、典型应用

  • 手机、平板和便携式设备的 I/O 口保护(USB、HDMI、耳机等)
  • 以太网、串行总线及差分信号线的静电与浪涌防护
  • 工业控制设备及通讯模块的接口防护
  • 智能穿戴、医疗电子等体积受限且对漏电敏感的场景

四、设计与布局建议

  • 将 TVS 尽可能靠近被保护引脚放置,走线短且宽以降低寄生电感。
  • 对高速差分线,注意对称布局,避免 TVS 引入不对称寄生电容。
  • 对于需要更强浪涌能力的场合,可并联或与串联阻抗配合使用,但需评估钳位和带宽影响。
  • 检查工作电压与 Vrwm(5 V)匹配,避免长期在击穿边缘工作。

五、选型与可靠性注意事项

  • 确认实际系统最大瞬态电流与 Ipp(5 A@8/20 μs)匹配,超额冲击需选择更高 Ipp 器件。
  • 若系统对钳位电压敏感,请评估钳位电压 15 V 是否在可接受范围内。
  • 温度与多次冲击下的参数可能变化,关键应用建议做带电寿命与冲击测试。

六、存储与焊接建议

  • 推荐采用常规贴片回流工艺,遵循器件供应商的温度曲线与湿敏等级(MSL)要求。
  • 储存环境避免潮湿和高温,贴片卷盘应在推荐时间内消耗,防止焊接缺陷。

本产品结合低电容、高功率吸收和超小体积封装,适合现代便携与高速接口的瞬态保护需求。若需详细的电气特性曲线、封装尺寸或样片测试报告,可提供更多资料以便进一步评估。

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