WMSIC Electronic Components

BORN SS510 SMA

ModelSS510 SMA
PackageSMA
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SS510 SMA
Type
BORN
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SS510 SMA
Electronic Component
1
Package
SMA
Electronic Component
Schottky Diode
Electronic Component
0.124g
Electronic Component
1
Electronic Component
BM0228592370
Current
5A
Diode
1
Current(Ir)
1mA@100V
(Vf)
850mV@5A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS510 (SMA) 产品概述

一、产品简介

SS510 为 BORN(伯恩半导体)出品的一款功率肖特基整流二极管,封装为 SMA(DO-214AC)。该器件面向中等功率整流与续流保护场合,具有较高的反向耐压与抗浪涌能力,典型参数:直流正向电流5A、直流反向耐压100V、单脉冲浪涌100A。器件可在宽温度范围内工作,结温范围为 -55℃ 到 +150℃,适合多种工业与消费电子场景。

二、电气参数要点

  • 正向压降(Vf):850mV @ If=5A。实测或典型值提示在5A条件下压降接近0.85V,设计时需将该压降乘以工作电流估算功耗。
  • 直流整流电流:5A(连续)。在保证散热的情况下可长期承载5A电流。
  • 反向电压(Vr):100V。适用于低至中等电压的整流与反向保护应用。
  • 反向漏电流(Ir):1mA @ 100V(典型/最大)。需注意随温度上升,漏电流将显著增加。
  • 非重复峰值浪涌电流(Ifsm):100A。用于短时浪涌或启动冲击,但需按脉冲宽度与波形(如8.3ms半正弦)核对热冲击能力。

三、热性能与封装说明

SMA(DO-214AC)为表面贴装封装,体积小、适合自动化贴装。因正向压降在高电流下会产生较大功耗(在5A时约4.25W),器件的热阻与PCB散热设计直接影响可靠性与允许电流。推荐措施:

  • 在PCB下方和周围增加铜箔面积(散热铺铜),并使用热过孔连接到下层铜层;
  • 对于连续5A应用,评估实际结-环境热阻并进行热仿真与实际温升测试;
  • 避免在高环境温度下长期接近结温上限(+150℃)。

四、典型应用场景

  • 开关电源输出整流与续流二极管;
  • DC-DC 转换器的输入/输出保护;
  • 电池充电器与电源管理模块的反接保护;
  • 汽车电子(在满足温度与浪涌规范下)以及消费类电源应用;
  • 含有过载或启动浪涌的负载保护(需配合合适的限流/软启动)。

五、选型与使用建议

  • 若系统对待机或高温下漏电流敏感(如精密测量、待机功耗严格限制),应谨慎评估1mA@100V的漏电流并考虑其他低漏型器件;
  • 在设计时按最大正向压降计算最坏情形下的功耗:P = Vf × I;并留出安全裕量;
  • 使用Ifsm参数时,务必参考厂方浪涌测试条件(脉冲宽度、间隔与温度),不要把脉冲峰值当作可反复的大电流承载能力;
  • 对于需要更低压降或更低漏电流的应用,可比较其他肖特基或同步整流方案。

六、焊接与存储注意

  • 遵循标准回流焊工艺,避免超过芯片资料中推荐的焊接峰值温度与时间;
  • 储存时防潮处理,打开干燥包后应按MSL等级尽快贴片回流;
  • 安装时注意器件极性方向与焊盘尺寸匹配,确保良好热接触与电气连接。

七、可靠性与采购建议

BORN(伯恩半导体)为该型号的品牌供应商,采购时建议索取完整数据手册以确认测试条件与参数容差,同时获取批次可靠性测试报告(热冲击、温度循环、ESD 抗扰度等)。在批量应用前进行样机验证,关注高温和浪涌工况下的实际表现,确保长期稳定工作。

总结:SS510(SMA)是一款面向中等功率整流与保护的肖特基二极管,优势在于100V耐压与较高的瞬态浪涌能力,适合多数电源与保护场合,但在高温或对漏电流严格的应用中需谨慎评估散热与漏电影响。

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